Conference Program

Accepted abstracts till today (list not finished)

Abstract Title Submitted by Company Presentation
Towards Etch Chuck Failure Predictability Thomas Ashby Imec oral
Automatic generation of APC Keynumbers based on anomaly detection for Al wire bonding Jan Papadoudis Infineon Technologies AG oral
Why do I need a Digital Twin anyway? Malte Moura INFICON GmbH oral
Advanced Gas and Chemical Distribution Management Jochen Kinauer camLine GmbH oral
Smart Virtual Collaboration to Optimize the Development Process in Semiconductor Industry Germar Schneider Infineon Technologies Dresden GmbH & Co. KG oral
Machine learning for cluster tool throughput optimizat Doug Suerich PEER Group oral
Two new methods for process control which take into account big data context consequences Francois Bergeret IPPON INNOVATION oral
Conflict Avoidance Strategies for Automated Guided Vehicles in Semiconductor Fabrication Facilities Karl-Benedikt Reith Technische Universität Dresden oral
Simulation versus Scheduling in Semiconductor Manufacturing – Some General Considerations and where (Artificial) Intelligence Could Possibly Help Peter Lendermann D-SIMLAB Technologies GmbH oral
Enhancing Design-relevant Document Search and Visibility through Fusion of Multi-sourced Data in Knowledge Graphs Hasan Abu Rasheed University of Siegen oral
The Benefits of Cloud Analytics in Semiconductor – A Real-time Application Case Study Joe Lee BISTel America oral
Real Time Data Display by Deployment of StreamSheets using FDC logfiles Dennis Föh TDK-Micronas GmbH oral
A Gaussian Process Regression Metamodel for Pattern Recognition in Current-Voltage Parameters of PERC Solar Cells Gerd Fischer Hochschule Zittau/Görlitz oral
How to integrate agile a tool into a MES Bert Müller Kontron AIS GmbH oral
Implementation of a simple RF related FDC strategy on AMAT Producer DXZ chambers to ensure a controlled process environment Armin Domitner ams AG poster
Enhanced PVD Preclean process control by combining SPC equipment checks with inline etch rate calculation by FDC Christina Wappl ams AG poster
Development and evaluation of a Blockchain concept for the IFD 300 mm Pre-Assembly Line Germar Schneider Infineon Technologies Dresden GmbH & Co. KG poster
Vibration Measurement and Visualization in Semiconductor AMHS Thomas Wagner TU Dresden poster
Overcoming Root Cause Analysis Challenges with Trace Analytics Joe Lee BISTel America poster
Common Data Extraction Layer for Root Cause Investigation in Semiconductor FAB Peter Czerner Elmos Semiconductor AG poster
Wafer defect map classification using convolutional neural network Irene Bianchi ST Microelectronics poster
Equipment Integration within minutes Bert Müller Kontron AIS GmbH poster