Agenda
Conference Program
Monday, April 08
Registration
Tutorial 1 - Part 1
Introduction to APC & Control of Isolated Manufacturing Steps
Klaus Kabitzsch | TU Dresden
Tutorial 2
PSYCHOLOGY IN DAILY BUSINESS
Dennis Föh | TDK-Micronas GmbH
BREAK
PLASMA WORKSHOP
Michael Klick | Plasmetrex GmbH
more...
Tutorial 1 - Part 2
Introduction to APC & Control of Isolated Manufacturing Steps
Klaus Kabitzsch | TU Dresden
LUNCH
Conference Opening Session
13:30
Conference Opening
Klaus Kabitzsch | TU Dresden
13:40
Welcome 1
Dr. Gaby Schaunig | Vice Governor of Province Kärnten
13:50
Welcome 2
Günther Albel | Mayor of Villach
Keynote 1
Intelligent Fab – beyond I4.0
Otto Graf | Robert Bosch Semiconductor Manufacturing Dresden GmbH
more...
Invited Talk
Product data and Product life cycle management in the face of new business models of the automotive industry
Rainer Hohenhoff | BMW Group
BREAK
Session 1 - Part 1
On-the-fly camera software solution for automatic perspective recognition of structured surfaces
Frederic Ringsleben | University Of Applied Sciences Mittweida
Predictive Probing: The Next Step in Virtual Metrology
Maike Stern | OSRAM Opto Semiconductors
Advanced Sampling Scheme Using Probabilistic Virtual Metrology
Daniel Kurz | Infineon Technologies Austria AG
Advanced 300 mm Wafer Container Investigations using an Automated FOUP Analyzing Platform
Peter Franze | Infineon Technologies Dresden
Session 2
Integrating Sensors to Reduce Scrap Events Utilizing an Integrated FDC Solution
Shannon Chavez | INFICON Inc.
COMBI MARK AUTOMATED OPTICAL INSPECTION
Savino Bonelli | LFoundry
FDC-Health Monitoring for Recipe Enhancements and Predictive Maintenance
Andreas Rockenbach | Robert Bosch GmbH
More than FDC...or how to highly customize a commercial FDC system
Dennis Föh | TDK-Micronas GmbH
Poster & Exhibitor Session
Poster Reception
Tuesday, April 09
Registration
Opening Remarks
Invited 2
The Role of APC and Smart Manufacturing/Industrie 4.0 in New Reliability-Critical Markets Such Automotive
James Moyne | Applied Materials
more...
BREAK
Session 1 - Part 2
Machine Learning for Network-based Intrusion Detection in Industry 4.0
Firooz Saghezchi | University of Aveiro
Multi-protocol Platform Architecture for Equipment Connectivity and Factory Data Analysis
Alan Weber | Cimetrix Inc.
Machine Learning – based on a intelligent Single Source of Truth
Oliver Jeutner | AIS Automation Dresden GmbH
Continuous Standard Compliance Verification in SemI40
Markus Tauber | University of Applied Sciences Burgenland
Session 3 - Part 1
Batch Optimization via Dispatching and Scheduling for Semiconductor Manufacturing
Gerhard Luhn | SYSTEMA Systementwicklung GmbH
Advanced Maintenance Management 4.0
Jochen Kinauer | camLine GmbH
Forecast of Logistical KPI in Fabrication Process
Lutz Muche | SYSTEMA Systementwicklung GmbH
Impact of Test Wafers in the Transportation System of a Semiconductor Factory
David Wittwer | TU Dresden
LUNCH
Session 1 - Part 3
A Novel Wafer Yield Deviation Root Cause Investigation Utilizing a Least-squares Spectral Analysis
Christian Weber | University of Siegen
An Investigation of Statistical Measures for Intensity Comparison of Process Patterns in Analog Wafer Test Data
Anna Jenul | KAI GmbH
Improving Root Cause Analysis Accuracy Using Advanced Sensor Trace Analytics
Max Zagrebnov | BISTel America
Session 4
Solving Parametric Drift Issues Through Trace Level Chamber Analysis
Mark Yelverton | BISTel America
Signal shape study from process control by interferometry for STI CMP
Sophia Bourzgui | STMicroelectronics
On-Line Screening of a Chemical-Mechanical Wafer Cleaning Process Based On Ordinal Measure
Bernat Zaragoza Travieso | Materials Center Leoben Forschung GmbH
BREAK
Session
Run-to-Run Control Based on Gaussian Bayesian Network in Semiconductor Manufacturing
Wei-Ting Yang | Ecole des Mines de Saint-Etienne
Transfer of Run-to-Run-Control to Production Control Level in Semiconductor Front-End
Dennis Bauer | Fraunhofer IPA
Sessions 3 - Part 2
STI Cone Defect Reduction and Reliability Calculations
Dr. Wolfgang Ploss | Texas Instruments GmbH Deutschland
Physics and chemistry behind plasma chamber conditioning for predictive maintenance
Michael Klick | Plasmetrex GmbH
Conference Dinner
Wednesday, April 10
Registration
Opening Remarks
Keynote 2
Sabine Herlitschka | Infineon Technologies Austria AG
Invited 3
Possibilities and Challenges of Digitalisation in the Semiconductor and Other Domains
Roman Kern | KNOW-CENTER GmbH
BREAK
Session 1 - Part 4
Cybersecurity for OEMs: protecting equipment against cyber threats
Doug Suerich | PEER Group
An Information-Theoretic Measure for Pattern Similarity in Analog Wafermaps
Bernhard Geiger | Know-Center GmbH
Chances & Challenges of Digitization in Semiconductor Fabs and Success Factors during the Implementation
Germar Schneider | Infineon Technologies Dresden
Manufacturing Capacity & Efficiency Improvements through FDC EPT Insights & Diagnostics
Jonathan Holt | PDF Solutions
Session 3 - Part 3
Applying DARP for Scheduling of Multiple-Load AGV in Semiconductor Industry Transport Systems
Patrick Boden | TU Dresden
Automatic FOUP Recognition for Autonomous Transport Robots
Edgar Scherstjanoi | TU Dresden
A Scalable Wafer Dispatching Strategy Based on Dynamic Programming
Alessio Mosca | University of Pavia
An Industry 4.0 Implementation for the Subfab
Andreas Neuber | Applied Materials