Agenda
Conference Program
Monday, April 16
Registration
Tutorial
Plasma Supervision Workshop
Opening Session
Session Chair: Klaus Kabitzsch
14:00 | Opening RemarksKlaus Kabitzsch | TU Dresden |
14:10 | Welcome AddressSabine Nitzsche | GLOBALFOUNDRIES |
14:30 | Keynote 1Advanced Process Control - a key lever to improve reliability in automotive electronicsDirk Drescher | X-FAB Dresden |
15:00 | Invited Talk 1Semantic Modeling in Automation as a Key Enabler for Next Generation Analytics and ApplicationsHenrik Dibowski | Honeywell |
BREAK
Session 1
Session Chair: Dennis Föh
1.1 Parameter Plasma Asymmetry used for Process Characterization
Michael Klick | Plasmetrex GmbH
1.2 Arcing Detection and Root Causes Analysis in Low Pressure PECVD
Karl Simon Siegert | Texas Instruments Deutschland GmbH
1.3 Monitoring and Control of Vacuum Processes Using a Remote Plasma Emission Spectroscopy Based Sensor
Florian Meyer | Gencoa Ltd.
Session 2
Session Chair: Johann W. Bartha
2.1 Advanced Thermal Mass Flow Controllers (MFCs) with EtherCAT Communication Protocol and Embedded Self Diagnostics
Mohamed Saleem | Brooks Instrument
2.2 Towards Robust Visual Wafer Cleaning Anomaly Detection
Romana Boiger | Materials Center Leoben Forschung GmbH
2.3 Non-Destructive X-Ray Metrology of GST Phase Change Material Deposition
Lars Grieger | MalvernPanalytical
Poster and Exhibitor Session
Poster Reception
Tuesday, April 17
Registration
Opening
Session Chair: Michael Klick
09:00 | Opening RemarksMichael Klick | Plasmetrex GmbH |
09:05 | Invited Talk 2Research Opportunities for European SemiconductorJohann Massoner | Infineon AUSTRIA |
09:45 | Invited Talk 3Applying the tenants of Industrie 4.0 / Smart Manufacturing to microelectronics manufacturingJames Moyne | Applied Materials |
BREAK
Session 3
Session Chair: Bert Müller
3.1 Fab Simulation and Virtualization – The Key to Enhance the Fab Performance within the Semiconductor Industry
Germar Schneider | Infineon Technologies Dresden
3.2 The granularity of the automated-generated long-term simulation model
Igor Stogniy | TU Dresden
3.3 FDC-based Equipment Deterioration Modeling and the Root Cause Identification in Semiconductor Industry
Hamideh Rostami | Ecole des Mines de Saint-Etienne
SESSION SPONSOR:
Session 4
Session Chair: Robert McCafferty
4.1 Practical Approach to Further Reducing False Alarms in Dynamic Fault Detection
Tom Ho | BISTel America
4.2 Temporal Convolutional Features Consolidated as a Virtual SVID for Process Diagnosis
Jakey Blue | École des Mines de Saint-Étienne
4.3 Integrating Dispatching Systems with Non-Threaded Run-to-Run Controllers
Richard Good | GLOBALFOUNDRIES
Lunch
Session 3 - Part 2
Session Chair: Alan Weber
3.5 "Data-driven analysis of vehicles routing in automated transportation systems"
Karsten Turek | TU Dresden
3.6 Optimal Wafer Dispatching based on Dynamic Programming
Alessio Mosca | University of Pavia
3.7 Product health assessment using patterns in semiconductor wafer test data
Anja Zernig | KAI GmbH
3.4 Statistical KPI Forecast in Semiconductor Manufacturing
Mike Gißrau | Systema Systementwicklung GmbH
SESSION SPONSOR:
Session 4 - Part 2
Session Chair: Gerald Rampf
4.4 Applying Big Data technologies to high tech manufacturing
Dirk Ortloff | camLine GmbH
4.5 Real-time Wafer Inventory Quality Assessment Using FDC Data
Max Zagrebnov | BISTel America
4.6 Datamining for Color Control
Sebastian Imhof | OSRAM Opto Semiconductors GmbH
4.7 Computational metrology: per wafer dense metrology without the need for more measurements
Paul Böcker | ASML Netherlands B.V.
BREAK
Session 1 - Part 2
Session Chair: Rupert Wagner
1.4 Real-time Plasma Uniformity Diagnosis Technique Using Revolving Module Adapted Optical Emission Spectroscopy
In Joong Kim | Yonsei University
1.5 End point detection for wet etching process by optical in-situ metrology
Kolja Haberland | LayTec AG
1.6 APC of complex Bosch Process @ SPTS Rapier
Michael Klick | Plasmetrex
Session 3 - Part 3
Session Chair: Germar Scheider
3.8 EDA Applications and Benefits for Smart Manufacturing
Alan Weber | Cimetrix
3.9 AMHS Real-Time Monitor
Martin Erler | TU Dresden
3.10 Mechanical stress evaluation of AGV based FOUP transport in comparison to OHT
Patrick Boden | TU Dresden
SESSION SPONSOR:
Conference Dinner
Wednesday, April 18
Registration
Opening
Session Chair: Michael Klick
09:00 | Opening RemarksMichael Klick | Plasmetrex GmbH |
09:05 | Invited Talk 4Prevention is better than cure – about the use of discrete-event simulation in a highly complex semiconductor FabWolfgang Scholl | Infineon Dresden |
09:45 | Invited Talk 5FDC to the power of 2 – how it got us to the next level of manufacturing excellenceJan Raebiger | Globalfoundries |
10:30 | Invited Talk 6Lithography Control is data hungryTom Hoogenboom | ASML |
Break
Session 3 - Part 4
Session Chair: Jochen Kinauer
3.11 Fast package unit integration in brownfield projects
Michael Obst | AIS Automation Dresden GmbH
3.12 Reducing Transport-Related Variability in Cycle Times by Optimized Transport Scheduling for Conveyor-Based AMHS
Clemens Schwenke | TU Dresden
3.13 A Simulation-based Evaluation of Characteristics of an AGV Transportation System
Karl-Benedikt Reith | TU Dresden
SESSION SPONSOR:
Session 4 - Part 3
Session Chair: James Moyne
4.8 Gaussian Process Regression for Virtual Metrology of High-Density Plasma Chemical Vapor Deposition
Daniel Kurz | Infineon Technologies Austria AG
4.9 Secure Data Collection Across an OEM’s Fleet of Tools
Doug Suerich | PEER Group
4.10 Real-time integration of process control, scheduling and dispatching
Robert Barlovic | GLOBALFOUNDRIES