Agenda
Conference Program
Times of the agenda are in Central European Summer Time (CEST)
Tuesday, April 13
Conference Opening Session
Opening Remarks
Martin Schellenberger | Fraunhofer IISB
Jochen Kinauer | camline GmbH
Invited Talk
Fab of the Future: From lights-out manufacturing to robots and humans in the loop
Dirk Reichelt | University of Applied Science Dresden & Fraunhofer IWU
Session 1 - Part 1
Session Chair: Alan Weber
1.1 "Smart Virtual Collaboration to Optimize the Development Process in Semiconductor Industry"
Germar Schneider | Infineon Technologies
1.2 "Conflict Avoidance Strategies for Automated Guided Vehicles in Semiconductor Fabrication Facilities"
Karl-Benedikt Reith | TU Dresden
1.3 "Smart People Counting System"
Feryel Zoghlami | Infineon Technologies
Session 1 - Part 2
Session Chair: Gerd Fischer
1.4 "Real Time Data Display by Deployment of StreamSheets using FDC logfiles"
Dennis Föh | TDK-Micronas GmbH
1.5 "How to integrate an equipment into an existing software landscape using value driven development"
Max Prengemann | Kontron AIS
1.6 "Efficient Hook-Up for complex production systems"
Torsten Thieme | DEAXO GmbH
Lunch
Session 2 - Part 1
Session Chair: Jochen Kinauer
2.1 "Two new methods for process control which take into account big data context consequences"
Francois Bergeret | IPPON & Sabine Mercier | University of Toulouse Jean Jaurès
2.2 "Complementing a conventional FDC system with automatic fault detection: A case study"
James Bramante | INFICON
2.3 "Enhancing Design-relevant Document Search and Visibility through Fusion of Multi-sourced Data in Knowledge Graphs"
Hasan Abu Rasheed | Uni Siegen
Session 2 - Part 2
Session Chair: Gerald Rampf
2.4 "Scheduling by High Performance Computing An example for AGV considering dynamic transport carrier transfers"
Patrick Boden | TU Dresden
2.5 "To Enhance and Optimise Material Flow and Capacity Planning in Semiconductor Frontend Manufacturing: Simulate or Schedule?"
Peter Lendermann | D-Simlab
2.6 "Pattern Aware Scheduling for Improved Productivity and Product Quality"
Matthew Purdy | INFICON
Break
Session 3 - Part 1
Session Chair: Michael Klick
3.1 "Machine Learning for Virtual Metrology: A State-of-the-art Review"
Rebecca Clain | EMSE
3.2 "Enabling SPC OCAP Automation"
Dirk Wollstein | Globalfoundries
3.3 "Semiconductor Smart Manufacturing: An Evolving Nexus of Business Drivers, Technologies, and Standards"
Alan Weber | Cimetrix
Session 3 - Part 2
Session Chair: Martin Schellenberger
3.5 "Wafer cleaning in always smaller node sizes"
Ralf Emberger | SONOSYS
3.6 "Two Orders of Magnitude Beyond the Ordinary... Real-Time Application of Geometric Process Control"
Robert McCafferty | RHM Consulting
Poster Session / Poster Presentation
Wednesday, April 14
Opening Remarks
Martin Schellenberger | Fraunhofer IISB
Jochen Kinauer | camline GmbH
Invited Talk
Knowledge Management & Innovation in 4.x (.0 & h) industrial context: Moving QMS (Quality Management System) from "problem solving" toward "expandable rationality"
Stéphane Hubac | ST Microelectronics
Session 4 - Part 1
Session Chair: Christian Knoell
4.1 "Fault Detection and Classification with Temporal Convolutional Features"
Nick Huang | Uni Taiwan
4.2 "Why do I need a Digital Twin anyway?"
John Behnke | INFICON
4.3 "Machine learning for cluster tool throughput optimizat"
Doug Suerich | PEER Group
Session 4 - Part 2
Session Chair: Bert Müller
4.4 "APC for the Backend: Machine Learning for Automated Control of Manual Adjustments in Aluminum Wire Bonding
Felix Klingert | Fraunhofer IISB
4.5 "Automatic generation of APC Keynumbers based on anomaly detection for Al wire bonding"
Jan Papadoudis | Infineon Technologies
4.6 "Detection of Faulty Wire Bond Connects Causing Reliability Fails through Digitization & Analysis of Bond Tool Sensor Data"
Jon Holt | PDF Solutions
Break
Session 5 - Part 1
Session Chair: Ute Nehring
5.1 "The Benefits of Cloud Analytics in Semiconductor – A Real-time Application Case Study"
Max Zagrebnov | Bistel
5.2 "A Gaussian Process Regression Metamodel for Pattern Recognition in Current-Voltage Parameters of PERC Solar Cells"
Gerd Fischer | HSZG
5.3 "Advanced Gas and Chemical Distribution Management"
Stephane Allard | Camline
Session 5 - Part 2
Session Chair: Rupert Wagner
5.4 "CD and Etch Rate Prediction by plasma parameters including RF losses and chamber conditioning"
Michael Klick | Plasmetrex
5.5 "Towards Etch Chuck Failure Predictability"
Thomas Ashby | Imec
5.6 "Differential Pressure-based Mass Flow for Advanced Semiconductor Manufacturing"
Andrew Staudt | Brooks Instrument
Closing Remarks
Jochen Kinauer | camline GmbH
Martin Schellenberger | Fraunhofer IISB