Agenda

Conference Program

Monday, April 16

8:00 - 9:00

Registration

9:00 - 12:30
11:00 - 12:30

Plasma Supervision Workshop

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14:00 - 15:40

Opening Session

Session Chair: Klaus Kabitzsch

14:00

Opening Remarks

Klaus Kabitzsch | TU Dresden
14:10

Welcome Address

Sabine Nitzsche | GLOBALFOUNDRIES

14:30

Keynote 1

Advanced Process Control - a key lever to improve reliability in automotive electronics
Dirk Drescher | X-FAB Dresden
15:00

Invited Talk 1

Semantic Modeling in Automation as a Key Enabler for Next Generation Analytics and Applications
Henrik Dibowski | Honeywell
15:40 - 16:15

BREAK

16:15 - 17:45

Session 1

Session Chair: Dennis Föh

1.1 Parameter Plasma Asymmetry used for Process Characterization
Michael Klick | Plasmetrex GmbH



1.2 Arcing Detection and Root Causes Analysis in Low Pressure PECVD
Karl Simon Siegert | Texas Instruments Deutschland GmbH

1.3 Monitoring and Control of Vacuum Processes Using a Remote Plasma Emission Spectroscopy Based Sensor
Florian Meyer | Gencoa Ltd.

Session 2

Session Chair: Johann W. Bartha

2.1 Advanced Thermal Mass Flow Controllers  (MFCs) with EtherCAT Communication Protocol and Embedded Self Diagnostics
Mohamed Saleem | Brooks Instrument

2.2 Towards Robust Visual Wafer Cleaning Anomaly Detection
Romana Boiger | Materials Center Leoben Forschung GmbH

2.3 Non-Destructive X-Ray Metrology of GST Phase Change Material Deposition
Lars Grieger | MalvernPanalytical

17:45 - 18:30

Poster and Exhibitor Session

18:30 - 21:00

Tuesday, April 17

8:00 - 9:00

Registration

9:00 - 10:30

Opening

Session Chair: Michael Klick

09:00

Opening Remarks

Michael Klick | Plasmetrex GmbH
09:05

Invited Talk 2

Research Opportunities for European Semiconductor
Johann Massoner | Infineon AUSTRIA
09:45

Invited Talk 3

Applying the tenants of Industrie 4.0 / Smart Manufacturing to microelectronics manufacturing
James Moyne | Applied Materials
10:30 - 11:00

BREAK

11:00 - 12:30

Session 3

Session Chair: Bert Müller

3.1 Fab Simulation and Virtualization – The Key to Enhance the Fab Performance within the Semiconductor Industry
Germar Schneider | Infineon Technologies Dresden

3.2 The granularity of the automated-generated long-term simulation model 
Igor Stogniy | TU Dresden



3.3 FDC-based Equipment Deterioration Modeling and the Root Cause Identification in Semiconductor Industry

Hamideh Rostami | Ecole des Mines de Saint-Etienne

SESSION SPONSOR:

 

 

Session 4

Session Chair: Robert McCafferty

4.1 Practical Approach to Further Reducing False Alarms in Dynamic Fault Detection
Tom Ho | BISTel America




4.2 Temporal Convolutional Features Consolidated as a Virtual SVID for Process Diagnosis 

Jakey Blue | École des Mines de Saint-Étienne

4.3 Integrating Dispatching Systems with Non-Threaded Run-to-Run Controllers
Richard Good | GLOBALFOUNDRIES

12:30 - 14:00

Lunch


14:00 - 16:00

Session 3 - Part 2

Session Chair: Alan Weber

3.5 "Data-driven analysis of vehicles routing in automated transportation systems" 
Karsten Turek | TU Dresden

3.6 Optimal Wafer Dispatching based on Dynamic Programming
Alessio Mosca | University of Pavia

3.7 Product health assessment using patterns in semiconductor wafer test data
Anja Zernig | KAI GmbH

3.4 Statistical KPI Forecast in Semiconductor Manufacturing
Mike Gißrau | Systema Systementwicklung GmbH

SESSION SPONSOR:

 

 

Session 4 - Part 2

Session Chair: Gerald Rampf

4.4 Applying Big Data technologies to high tech manufacturing
Dirk Ortloff | camLine GmbH

4.5 Real-time Wafer Inventory Quality Assessment Using FDC Data
Max Zagrebnov
| BISTel America

4.6 Datamining for Color Control
Sebastian Imhof | OSRAM Opto Semiconductors GmbH

4.7 Computational metrology: per wafer dense metrology without the need for more measurements
Paul Böcker | ASML Netherlands B.V.

16:00 - 16:30

BREAK

16:30 - 18:00

Session 1 - Part 2

Session Chair: Rupert Wagner

1.4 Real-time Plasma Uniformity Diagnosis Technique Using Revolving Module Adapted Optical Emission Spectroscopy
In Joong Kim | Yonsei University

1.5 End point detection for wet etching process by optical in-situ metrology 
Kolja Haberland | LayTec AG

1.6 APC of complex Bosch Process @ SPTS Rapier
Michael Klick | Plasmetrex

Session 3 - Part 3

Session Chair: Germar Scheider

3.8 EDA Applications and Benefits for Smart Manufacturing
Alan Weber | Cimetrix



3.9 AMHS Real-Time Monitor 

Martin Erler | TU Dresden



3.10 Mechanical stress evaluation of AGV based FOUP transport in comparison to OHT

Patrick Boden | TU Dresden

SESSION SPONSOR:

 

 

18:00 - 22:00

Conference Dinner

Wednesday, April 18

8:00 - 9:00

Registration

9:00 - 11:15

Opening

Session Chair: Michael Klick

09:00

Opening Remarks

Michael Klick | Plasmetrex GmbH
09:05

Invited Talk 4

Prevention is better than cure – about the use of discrete-event simulation in a highly complex semiconductor Fab
Wolfgang Scholl | Infineon Dresden
09:45

Invited Talk 5

FDC to the power of 2 – how it got us to the next level of manufacturing excellence
Jan Raebiger | Globalfoundries

10:30

Invited Talk 6

Lithography Control is data hungry
Tom Hoogenboom | ASML
11:15 - 11:45

Break

11:45 - 13:15

Session 3 - Part 4

Session Chair: Jochen Kinauer

3.11 Fast package unit integration in brownfield projects
Michael Obst | AIS Automation Dresden GmbH



3.12 Reducing Transport-Related Variability in Cycle Times by Optimized Transport Scheduling for Conveyor-Based AMHS

Clemens Schwenke | TU Dresden

3.13 A Simulation-based Evaluation of Characteristics of an  AGV Transportation System
Karl-Benedikt Reith | TU Dresden

SESSION SPONSOR:

 

 

Session 4 - Part 3

Session Chair: James Moyne

4.8 Gaussian Process Regression for Virtual Metrology of High-Density Plasma Chemical Vapor Deposition
Daniel Kurz | Infineon Technologies Austria AG

4.9 Secure Data Collection Across an OEM’s Fleet of Tools
Doug Suerich | PEER Group




4.10 Real-time integration of process control, scheduling and dispatching

Robert Barlovic | GLOBALFOUNDRIES

 

 

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