Conference Program

Accepted abstracts for Oral Presentation

Abstract Title Submitted by Company
The Benefits of Cloud Analytics in Semiconductor – A Real-time Application Case Study Joe Lee BISTel America
Advanced Gas and Chemical Distribution Management Jochen Kinauer camLine GmbH
Semiconductor Smart Manufacturing: An Evolving Nexus of Business Drivers, Technologies, and Standards Alan Weber Cimetrix, Inc.
Fully automated real-time recipe verification Robert Barlovic GLOBALFOUNDRIES
Machine Learning in the Cloud for an Predictive Maintenance Solution on Implant Ion Sources Dirk Wollstein Globalfoundries
Enabling SPC OCAP Automation Andre Holfeld GLOBALFOUNDRIES Fab1
A Gaussian Process Regression Metamodel for Pattern Recognition in Current-Voltage Parameters of PERC Solar Cells Gerd Fischer Hochschule Zittau/Görlitz
Towards Etch Chuck Failure Predictability Thomas Ashby Imec
Machine Learning for Anomaly Detection Pierre Wellner INFICON
Why do I need a Digital Twin anyway? Malte Moura INFICON GmbH
Automatic generation of APC Keynumbers based on anomaly detection for Al wire bonding Jan Papadoudis Infineon Technologies AG
Smart Virtual Collaboration to Optimize the Development Process in Semiconductor Industry Germar Schneider Infineon Technologies Dresden GmbH & Co. KG
Mixed Linear Models for Data-driven Root Cause Investigation in Semiconductor Frontend Production Martin Pleschberger KAI GmbH
Machine Learning for Virtual Metrology: A State-of-the-art Review Rebecca Clain Mines saint Etienne
Fault Detection and Classification with Temporal Convolutional Features Jakey Blue National Taiwan University
Detection of Faulty Wire Bond Connects Causing Reliability Fails through Digitization & Analysis of Bond Tool Sensor Data Jon Holt PDF Solutions
Machine learning for cluster tool throughput optimizat Doug Suerich PEER Group
Gas utilization and reduction for etching and PECVD cleans Michael Klick Plasmetrex
PECVD NEEDs Deposition Rate Control in Production Michael Klick Plasmetrex
MEMS process optimization and chamber matching by means of sensor and process model Michael Klick Plasmetrex
Two Orders of Magnitude Beyond the Ordinary... Real-Time Application of Geometric Process Control Robert McCafferty RHM Consulting
Automatic Defect Classification of images of defect or Wafermap using Deep Learning Laurent Bidault STMicroelectronics
Real Time Data Display by Deployment of StreamSheets using FDC logfiles Dennis Föh TDK-Micronas GmbH
Conflict Avoidance Strategies for Automated Guided Vehicles in Semiconductor Fabrication Facilities Karl-Benedikt Reith Technische Universität Dresden
Enhancing Design-relevant Document Search and Visibility through Fusion of Multi-sourced Data in Knowledge Graphs Hasan Abu Rasheed University of Siegen

Accepted abstracts for Poster Presentation

Abstract Title Submitted by Company
Implementation of a simple RF related FDC strategy on AMAT Producer DXZ chambers to ensure a controlled process environment Armin Domitner ams AG
Enhanced PVD Preclean process control by combining SPC equipment checks with inline etch rate calculation by FDC Christina Wappl ams AG
Securing one-bath etching and rinsing processes on wet-chemistry batch tools Eva Lackner ams AG
Overcoming Root Cause Analysis Challenges with Trace Analytics Joe Lee BISTel America
Common Data Extraction Layer for Root Cause Investigation in Semiconductor FAB Peter Czerner Elmos Semiconductor AG
Root Cause and Split Group Investigation for One-Lot-Anomalies as Method Set and Tool Peter Czerner Elmos Semiconductor AG
Development and evaluation of a Blockchain concept for the IFD 300 mm Pre-Assembly Line Germar Schneider Infineon Technologies Dresden GmbH & Co. KG
Wafer defect map classification using convolutional neural network Irene Bianchi ST Microelectronics
Sensitivity Enhancement of Optical Emission Spectroscopy Signals of Plasma Enhanced Chemical Vapor Deposition Processes Using Modified Gaussian Mixture Model Sun Jung Kim Sungkyunkwan University (SKKU)
Vibration Measurement and Visualization in Semiconductor AMHS Thomas Wagner TU Dresden

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