Agenda
Conference Program
Tuesday, March 28
Registration
Entrance Area - Level 0
Tutorial
Meeting Rooms 1 & 2 - Level 3
Roland Willmann / Carinthia University of Applied Sciences
More information
Participation only by registration! (https://forms.office.com/e/T3MFSNfu0i)
Opening & Welcome
Auditorium B - Level 1
Opening
Martin Schellenberger (Fraunhofer IISB) & Jochen Kinauer (CamLine)
Welcome
Welcome by the mayor of Bruges - Mr. Dirk De fauw
Invited Talk
Auditorium B - Level 1
GaN, BelGaN & GaN ValleyTM: a paradigm shift in power semiconductors.
Dr. Marnix Tack, CTO and VP Business Development / BelGaN
Short break to change rooms
SESSION 1 - PART 1
sponsored by:
Auditorium B - Level 1
Session Chair: Bert Müller
1.2 Future Innovation Process in Semiconductor Manufacturing Towards Sustainable & Resilient Production & Products (FIRes)
Germar Schneider / Infineon Technologies Dresden GmbH & Co. KG
1.3 A Modern Architecture and Methodology for Automating Equipment Process Control using AI/ML
Jon Holt / PDF Solutions
SESSION 2 - PART 1
sponsored by:
Meeting 1&2 - Level 3
Session Chair: Alan Weber
2.5 An Innovative Wet Process Concentration Monitoring Concept in a High Volume Semiconductor Factory
Lorenz Konopatzky / Infineon
2.2 Novel Time-of-Flight Residual Gas Analyzer (TOF-RGA) for in situ Real-time Process Monitoring
Lukas Hofer / Spacetek
2.3 Epi process modeling for uniformity R2R
André Horn / Infineon
Coffee Break
Conference Area - Level 4
sponsored by:
Sponsor Talk - Flanders Investment & Trade
Auditorium B - Level 1
The Flanders Semiconductor Initiative
Lou Hermans, Managing Director HCM & Cluster Manager Flanders Semiconductors
Poster & Exhibitor Presentation
Auditorium B - Level 1
Poster Presentation
Session Chair: Martin Schellenberger
P201 IC surface anomaly detection and localization with Variational Autoencoder
Minh Khai Le / Elmos Semiconductor SE
P202 K Means Clustering for solving matching problems in Semiconductor factories
Vishali Ragam / Applied Materials
P203 Turn Grey SPC Charts into Colorful Insights with the Help of Feature Selection
Steven Hoheisel / X-FAB Dresden GmbH & Co. KG
P204 Analysis of Optical Emission Spectroscopy Signals for Plasma Process Monitoring and Fault Detection Classification with Principal Component Analysis
Heeyeop Chae / SKKU
P301 Automation and Digitalization along the Supply Chain for Power Semiconductors from Wafer Supplier to Backend Manufacturer
Fabian Lindner / Zittau/Görlitz University of Applied Sciences
P302 The Impact of Tool Allocation and Dedication on Cycle Time
Felipe Lipp Bregolin / Applied Materials
Exhibitor Presentation
Session Chair: Jochen Kinauer
Applied Materials
INFICON GmbH
Fraunhofer ENAS
Tohoku University
Gauss Labs
SPEA GmbH
KDT JU
POSAS GmbH
SENTECH Gesellschaft für Sensortechnik mbH
Cimetrix Incorporated
EPoSS
ASCENT+
Infraserv Vakuumservice GmbH
Poster Reception
Conference Area - Level 4
sponsored by:
Wednesday, March 29
Registration
Entrance Area - Level 0
Opening & Sponsor Talks
Auditorium B - Level 1
Opening:
Martin Schellenberger (Fraunhofer IISB) & Jochen Kinauer (CamLine)
Sponsor Talks:
Unifying Process Control to Disrupt Manufacturing Principles
Christopher Reeves, Global Product Manager, E3 Platform, Applied Materials
Invited Talk
Auditorium B - Level 1
NOVEL APPROACH TO MASTER THE CHALLENGES OF RUN-TO-RUN CONTROL IN HIGH-MIX LOW-VOLUME PRODUCTION – 2
Ulf Seidel | Infineon Technologies Dresden
Coffee Break
Conference Area - Level 4
sponsored by:
SESSION 1 - PART 2
sponsored by:
Auditorium B - Level 1
Session Chair: Bert Müller
1.4 Hierarchical variance analysis of solar cell production using machine learning and numerical simulations
Bernhard Klöter / Wavelabs Solar Metrology
1.5 FDC Real Time Monitoring AMCs of PICARRO analytical system
Martina Scollo / STMicroelectronics
1.6 Adopting cybersecurity standards for semiconductor factories
Doug Suerich / PEER Group Inc.
SESSION 3 - PART 1
sponsored by:
Meeting 1&2 - Level 3
Session Chair: Jochen Kinauer
3.1 Validating the technical risk of product transfer or technology transfer between heterogenous manufacturing sites
Roland Willmann / Carinthia University of Applied Sciences
3.2 Predictive Equipment Health Based on Hidden Markov Model and Production Scheduling
Jakey Blue / National Taiwan University
3.3 BIM for Building Construction Operations to create the fundamentals for a Digital Twin
Torsten Thieme / Deaxo
Lunch
Conference Area - Level 4
sponsored by: 
SESSION 1 - PART 3
sponsored by:
Auditorium B - Level 1
Session Chair: Ulf Seidel
1.7 Deployment of SPC 4.0: ML-based OOC detection with integrated in-line/on-line multivariate root-cause analysis
Ilham Rabhi , Kalle Ylä-Jarkko / École Nationale Supérieure des Mines de Saint-Étienne
1.8 Statistical path modelling of semiconductor manufacturing process data
Geert van Kollenburg / Eindhoven University of Technology
1.9 Seeing is Understanding: Improving the Visibility into Smart Manufacturing Operations Through Advanced Visualization Technology
Alan Weber / Cimetrix
SESSION 2 - PART 2
sponsored by:
Meeting 1&2 - Level 3
Session Chair: Gerd Fischer
2.4 Optical in-situ control with sub-nm precision for endpoint detection in atomic layer etching for GaN MISHEMT structures
Kolja Haberland / LayTec AG
2.1 An IoT Solution for in-situ Dispense Detection and Photoresist Consumption Control in Lithography Coater Tools
Yvonne Bergmann / Robert Bosch
2.6 Chemical flow monitoring system
Natalina Di Stefano / STMicroelectronics & Daniele Lavalle / Techno Fittings
Coffee Break
Conference Area - Level 4
sponsored by:
SESSION 1 - PART 4
sponsored by:
Auditorium B - Level 1
Session Chair: Martin Schellenberger
1.10 Inconvenient Truths... and Their Discovery
Robert McCafferty / RHM Consulting
1.11 Visual Inspection System for Predictive Maintenance of Overhead Transportation Vehicles
Christian Hörr / Carl Zeiss Digital Innovation GmbH & Hans Klingstedt / Smart Systems Hub
SESSION 3 - PART 2
sponsored by:
Meeting 1&2 - Level 3
Session Chair: Ulf Seidel
3.4 Automatic Line Balance Control using a Digital Twin Production System with an Optimizing Factory Scheduler
Eric Wiedemann / Inficon
3.5 A Multi-Objective Simulation-Based Scheduling Approach for Wafer Fab Operations
Peter Lendermann / D-SIMLAB
Break/End of Conference Day
Conference Dinner
Dinner & Brewery visit
De Halve Maan (Straffe Hendrik) Brewery
The journey begins in the brewing hall where all the beers are brewed. The tour continues and you’ll discover the many brewing installations that have been used over the past centuries. At the brewery's rooftop you can enjoy a 360° view over the city center of Bruges. At the end of your journey, we offer you an unfiltered Brugse Zot Blond, Brugse Zot Dubbel or Straffe Hendrik Tripel.
Inside the brewery you’ll find the restaurant where our evening dinner will take place. It has a very cosy and authentic atmosphere. Enjoy the tasty specialty beers or delicious home-made meals. Discover the unique and historical setting with a unique view across the brewing hall.
sponsored by:
Thursday, March 30
Registration
In front of Auditorium - Level 1
Opening & Keynote
Auditorium B - Level 1
Opening
Martin Schellenberger (Fraunhofer IISB) & Jochen Kinauer (CamLine)
Keynote
A Silicon Symphony: Overview on industry and market developments for the European semiconductor industry
Frank Bösenberg / Silicon Saxony
SESSION 1 - PART 5
sponsored by:
Auditorium B - Level 1
Session Chair: Alan Weber
1.12 Reliable, Robust, and Scalable Virtual Metrology for Process Control in High Volume Manufacturing
Brendon Choe / Gauss Labs Inc.
SESSION 2 - PART 3
sponsored by:
Meeting 1&2 - Level 3
Session Chair: Bert Müller
2.7 Spectral Clustering Algorithm for Real-Time Plasma Etching Process Monitoring using Optical Emission Spectra
Seonghyeon Lee / Sungkyunwan University (SKKU)
Coffee Break
Conference Area - Level 4
sponsored by:
SESSION 1 - PART 6
sponsored by:
Auditorium B - Level 1
Session Chair: Gerd Fischer
1.13 minds.ai Maestro: Optimized fab scheduling using reinforcement learning
Jasper van Heugten / minds.ai
1.14 Can empirical physics models improve machine learning performance using planarization data?
Tom Rothe / Fraunhofer ENAS
1.15 CSAM anomaly detection with AI
Jason Zi Jie Chia / Elmos
SESSION 3 - PART 3
sponsored by:
Meeting 1&2 - Level 3
Session Chair: Ulf Seidel
3.6 SelfMade Scheduler for Lithography
Carina Malinowska / X-FAB Dresden GmbH & Co. KG
3.7 Smart from the Ground Up: Facilities Control and Integration
Christopher Bode / Inficon
3.8 Equipment Standardization in the field of MEMS Testing
Oleg Fotteler / Spea
Lunch
Conference Area - Level 4
sponsored by:
Invited Talk
Auditorium B - Level 1
tba
Award Ceremony & Closing
Auditorium B - Level 1
City Tour & Farewell Gothic Hall
Participation only by registration! (https://forms.office.com/e/T3MFSNfu0i)