Agenda

Conference Program

Monday, April 08

8:00 - 18:00

Registration

9:00 - 10:30

Tutorial 1 - Part 1

Introduction to APC & Control of Isolated Manufacturing Steps
Klaus Kabitzsch | TU Dresden

Tutorial 2

PSYCHOLOGY IN DAILY BUSINESS
Dennis Föh | TDK-Micronas GmbH

10:30 - 11:00

BREAK

11:00 - 12:30

PLASMA WORKSHOP

Michael Klick | Plasmetrex GmbH
more...

Tutorial 1 - Part 2

Introduction to APC & Control of Isolated Manufacturing Steps
Klaus Kabitzsch | TU Dresden

12:30 - 13:30

LUNCH

13:30 - 14:00

Conference Opening Session

13:30
Conference Opening

Klaus Kabitzsch | TU Dresden

13:40
Welcome 1
Dr. Gaby Schaunig | Vice Governor of Province Kärnten

13:50
Welcome 2

Günther Albel | Mayor of Villach

14:00 - 14:25

Keynote 1

Intelligent Fab – beyond I4.0
Otto Graf | Robert Bosch Semiconductor Manufacturing Dresden GmbH
more...

14:25 - 15:10

Invited Talk

Product data and Product life cycle management in the face of new business models of the automotive industry
Rainer Hohenhoff | BMW Group

15:10 - 15:45

BREAK

15:45 - 17:45

Session 1 - Part 1

On-the-fly camera software solution for automatic perspective recognition of structured surfaces
Frederic Ringsleben | University Of Applied Sciences Mittweida

Predictive Probing: The Next Step in Virtual Metrology
Maike Stern | OSRAM Opto Semiconductors

Advanced Sampling Scheme Using Probabilistic Virtual Metrology
Daniel Kurz | Infineon Technologies Austria AG

Advanced 300 mm Wafer Container Investigations using an Automated FOUP Analyzing Platform
Peter Franze | Infineon Technologies Dresden

Session 2

Integrating Sensors to Reduce Scrap Events Utilizing an Integrated FDC Solution
Shannon Chavez | INFICON Inc.

COMBI MARK AUTOMATED OPTICAL INSPECTION
Savino Bonelli | LFoundry

FDC-Health Monitoring for Recipe Enhancements and Predictive Maintenance 
Andreas Rockenbach | Robert Bosch GmbH

More than FDC...or how to highly customize a commercial FDC system
Dennis Föh | TDK-Micronas GmbH

17:45 - 18:30

Poster & Exhibitor Session

18:30 - 20:00

Poster Reception

Tuesday, April 09

8:00 - 17:00

Registration

9:00 - 9:10

Opening Remarks

9:10 - 9:55

Invited 2

The Role of APC and Smart Manufacturing/Industrie 4.0 in New Reliability-Critical Markets Such Automotive
James Moyne | Applied Materials
more...

9:55 - 10:30

BREAK

10:30 - 12:30

Session 1 - Part 2

Machine Learning for Network-based Intrusion Detection in Industry 4.0
Firooz Saghezchi | University of Aveiro

Multi-protocol Platform Architecture for Equipment Connectivity and Factory Data Analysis
Alan Weber | Cimetrix Inc.

Machine Learning – based on a intelligent Single Source of Truth
Oliver Jeutner | AIS Automation Dresden GmbH

Continuous Standard Compliance Verification in SemI40
Markus Tauber | University of Applied Sciences Burgenland

Session 3 - Part 1

Batch Optimization via Dispatching and Scheduling for Semiconductor Manufacturing
Gerhard Luhn | SYSTEMA Systementwicklung GmbH

Advanced Maintenance Management 4.0
Jochen Kinauer | camLine GmbH

Forecast of Logistical KPI in Fabrication Process
Lutz Muche | SYSTEMA Systementwicklung GmbH

Impact of Test Wafers in the Transportation System of a Semiconductor Factory
David Wittwer | TU Dresden

12:30 - 14:00

LUNCH

14:00 - 15:30

Session 1 - Part 3

A Novel Wafer Yield Deviation Root Cause Investigation Utilizing a Least-squares Spectral Analysis
Christian Weber | University of Siegen

An Investigation of Statistical Measures for Intensity Comparison of Process Patterns in Analog Wafer Test Data
Anna Jenul | KAI GmbH

Improving Root Cause Analysis Accuracy Using Advanced Sensor Trace Analytics
Max Zagrebnov | BISTel America

Session 4

Solving Parametric Drift Issues Through Trace Level Chamber Analysis
Mark Yelverton | BISTel America

Signal shape study from process control by interferometry for STI CMP
Sophia Bourzgui | STMicroelectronics

On-Line Screening of a Chemical-Mechanical Wafer Cleaning Process Based On Ordinal Measure
Bernat Zaragoza Travieso | Materials Center Leoben Forschung GmbH

15:30 - 16:00

BREAK

16:00 - 17:00

Session

Run-to-Run Control Based on Gaussian Bayesian Network in Semiconductor Manufacturing
Wei-Ting Yang | Ecole des Mines de Saint-Etienne

Transfer of Run-to-Run-Control to Production Control Level in Semiconductor Front-End
Dennis Bauer | Fraunhofer IPA

Sessions 3 - Part 2

STI Cone Defect Reduction and Reliability Calculations
Dr. Wolfgang Ploss | Texas Instruments GmbH Deutschland

Physics and chemistry behind plasma chamber conditioning for predictive maintenance
Michael Klick | Plasmetrex GmbH

17:00 - 22:00

Conference Dinner

Wednesday, April 10

8:00 - 12:00

Registration

9:00 - 9:10

Opening Remarks

9:10 - 9:40

Keynote 2

Sabine Herlitschka | Infineon Technologies Austria AG

9:40 - 10:25

Invited 3

Possibilities and Challenges of Digitalisation in the Semiconductor and Other Domains
Roman Kern | KNOW-CENTER GmbH

10:25 - 11:00

BREAK

11:00 - 13:00

Session 1 - Part 4

Cybersecurity for OEMs: protecting equipment against cyber threats
Doug Suerich | PEER Group

An Information-Theoretic Measure for Pattern Similarity in Analog Wafermaps
Bernhard Geiger | Know-Center GmbH

Chances & Challenges of Digitization in Semiconductor Fabs and Success Factors during the Implementation
Germar Schneider | Infineon Technologies Dresden

Manufacturing Capacity & Efficiency Improvements through FDC EPT Insights & Diagnostics
Jonathan Holt | PDF Solutions

Session 3 - Part 3

Applying DARP for Scheduling of Multiple-Load AGV in Semiconductor Industry Transport Systems
Patrick Boden | TU Dresden

Automatic FOUP Recognition for Autonomous Transport Robots
Edgar Scherstjanoi | TU Dresden

A Scalable Wafer Dispatching Strategy  Based on Dynamic Programming
Alessio Mosca | University of Pavia

An Industry 4.0 Implementation for the Subfab
Andreas Neuber | Applied Materials

 

 

13:00 - 13:10

Closing Remarks

13:10 - 14:00

LUNCH

Further conference days