Agenda
Conference Program
Monday, April 08
Registration
Tutorial 1 - Part 1
Introduction to APC & Control of Isolated Manufacturing Steps
Klaus Kabitzsch | TU Dresden
Tutorial 2
Psychology in daily business
Dennis Föh | TDK-Micronas GmbH
BREAK
PLASMA WORKSHOP
Michael Klick | Plasmetrex GmbH
more...
Tutorial 1 - Part 2
Introduction to APC & Control of Isolated Manufacturing Steps
Klaus Kabitzsch | TU Dresden
LUNCH
Conference Opening Session
13:30
Opening Remarks
Klaus Kabitzsch | TU Dresden
13:40
Welcome Address 1
Dr. Gaby Schaunig | Vice Governor of Province Kärnten
13:50
Welcome Address 2
Günther Albel | Mayor of Villach
Keynote 1
Intelligent Fab – beyond I4.0
Otto Graf | Robert Bosch Semiconductor Manufacturing Dresden GmbH
more...
Invited Talk 1
Product data and Product life cycle management in the face of new business models of the automotive industry
Rainer Hohenhoff | BMW Group
BREAK
Session 1 - Part 1
Session Chair: Martin Schellenberger
1.1 On-the-fly camera software solution for automatic perspective recognition of structured surfaces
Frederic Ringsleben | University Of Applied Sciences Mittweida
1.2 Predictive Probing: The Next Step in Virtual Metrology
Maike Stern | OSRAM Opto Semiconductors
1.3 Advanced Sampling Scheme Using Probabilistic Virtual Metrology
Daniel Kurz | Infineon Technologies Austria AG
1.4 Advanced 300 mm Wafer Container Investigations using an Automated FOUP Analyzing Platform
Peter Franze | Infineon Technologies Dresden
Session 2
Session Chair: Didier Vieux
2.1 Integrating Sensors to Reduce Scrap Events Utilizing an Integrated FDC Solution
Shannon Chavez | INFICON Inc.
2.2 Physics and chemistry behind plasma chamber conditioning for predictive maintenance
Michael Klick | Plasmetrex GmbH
2.3 FDC-Health Monitoring for Recipe Enhancements and Predictive Maintenance
Andreas Rockenbach | Robert Bosch GmbH
2.4 More than FDC...or how to highly customize a commercial FDC system
Dennis Föh | TDK-Micronas GmbH
Poster & Exhibitor Session
Poster Reception
Tuesday, April 09
Registration
Opening Remarks
Invited Talk 2
The Role of APC and Smart Manufacturing/Industrie 4.0 in New Reliability-Critical Markets Such Automotive
James Moyne | Applied Materials
more...
BREAK
Session 1 - Part 2
Session Chair: Gerald Rampf
1.5 Machine Learning – based on a intelligent Single Source of Truth
Bert Müller | AIS Automation Dresden GmbH
1.6 Addressing Connectivity Challenges of Disparate Data Sources in Smart Manufacturing
Alan Weber | Cimetrix Inc.
1.7 Machine Learning for Network-based Intrusion Detection in Industry 4.0
Firooz Saghezchi | University of Aveiro
1.8 Continuous Standard Compliance Verification in SemI40
Markus Tauber | University of Applied Sciences Burgenland
Session 3 - Part 1
Session Chair: Jochen Kinauer
3.1 Batch Optimization via Dispatching and Scheduling for Semiconductor Manufacturing
Gerhard Luhn | SYSTEMA Systementwicklung GmbH
3.2 Advanced Maintenance Management 4.0
Jochen Kinauer | camLine GmbH
3.3 Forecast of Logistical KPI in Fabrication Process
Lutz Muche | SYSTEMA Systementwicklung GmbH
3.4 Impact of Test Wafers in the Transportation System of a Semiconductor Factory
David Wittwer | TU Dresden
LUNCH
Session 1 - Part 3
Session Chair: Michael Klick
1.9 A Novel Wafer Yield Deviation Root Cause Investigation Utilizing a Least-squares Spectral Analysis
Christian Weber | University of Siegen
1.10 An Investigation of Statistical Measures for Intensity Comparison of Process Patterns in Analog Wafer Test Data
Anna Jenul | KAI GmbH
1.11 Improving Root Cause Analysis Accuracy Using Advanced Sensor Trace Analytics
Max Zagrebnov | BISTel America
Session 4
Session Chair: Ulf Seidel
4.1 Solving Parametric Drift Issues Through Trace Level Chamber Analysis
Mark Yelverton | BISTel America
4.2 Signal shape study from process control by interferometry for STI CMP
Sophia Bourzgui | STMicroelectronics
4.3 On-Line Screening of a Chemical-Mechanical Wafer Cleaning Process Based On Ordinal Measure
Bernat Zaragoza Travieso | Materials Center Leoben Forschung GmbH
BREAK
Session 1 - Part 4
Session Chair: James Moyne
1.12 Run-to-Run Control Based on Gaussian Bayesian Network in Semiconductor Manufacturing
Wei-Ting Yang | Ecole des Mines de Saint-Etienne
1.13 Transfer of Run-to-Run-Control to Production Control Level in Semiconductor Front-End
Dennis Bauer | Fraunhofer IPA
Session 2 - Part 2
Session Chair: Dennis Föh
2.5 STI Cone Defect Reduction and Reliability Calculations
Dr. Wolfgang Ploss | Texas Instruments GmbH Deutschland
2.6 Root cause analysis for via hole faults using digital twin
Michael Klick | Plasmetrex GmbH
Conference Dinner
Wednesday, April 10
Registration
Opening Remarks
Keynote 2
Günter Schagerl | Infineon Technologies Austria AG
Invited Talk 3
Possibilities and Challenges of Digitalisation in the Semiconductor and Other Domains
Roman Kern | KNOW-CENTER GmbH
BREAK
Session 1 - Part 5
Session Chair: Robert McCafferty
1.14 Cybersecurity for OEMs: protecting equipment against cyber threats
Doug Suerich | PEER Group
1.15 An Information-Theoretic Measure for Pattern Similarity in Analog Wafermaps
Bernhard Geiger | Know-Center GmbH
1.16 Chances & Challenges of Digitization in Semiconductor Fabs and Success Factors during the Implementation
Germar Schneider | Infineon Technologies Dresden
1.17 Manufacturing Capacity & Efficiency Improvements through FDC EPT Insights & Diagnostics
Jonathan Holt | PDF Solutions
Session 3 - Part 2
Session Chair:Alan Weber
3.5 Applying DARP for Scheduling of Multiple-Load AGV in Semiconductor Industry Transport Systems
Patrick Boden | TU Dresden
3.6 Automatic FOUP Recognition for Autonomous Transport Robots
Edgar Scherstjanoi | TU Dresden
3.7 A Scalable Wafer Dispatching Strategy Based on Dynamic Programming
Alessio Mosca | University of Pavia
3.8 An Industry 4.0 Implementation for the Subfab
Hemant Mungekar | Applied Materials