Agenda
Conference Program
Times of the agenda are in Central European Summer Time (CEST)
Monday, April 04
Registration
Welcome & Opening
Martin Schellenberger & Jochen Kinauer
Welcome & Invited Talk
Jean François Christaud
Manufacturing Digitalization Director in ST Microelectronics
Opening Talk
Strategic Approaches for Further Development of SiC Rapid Prototype Production
Dr. Sabrina Anger | Fraunhofer Institute for Integrated Systems and Device Technology IISB
Break
Session 1 | Part 1
Session Chair: Robert McCafferty
1.1 Contextual Pattern Mining to drive Process Quality
Vishali Ragam | Applied Materials
1.2 Efficient Sensor Integration using IoT Frameworks in the Semiconductor Industry
Dr. Germar Schneider | Infineon Technologies Dresden
1.3 How to integrate and use up to 10kH High Frequency Data for FDC and Data Analysis
Frank Wagenbreth | GlobalFoundries
Session 2 | Part 1
Session Chair: Bert Müller
2.1 NMP Replacement In Photoresist Stripping Processes – The Sustainable High-Performance Alternative
Dr. Alexander Breul | intelligent fluids
2.2 Integration of external photoresist flow sensors in a semiconductor production environment: an IoT approach
Dr. Yvonne Bergmann | Robert Bosch GmbH
2.3 Machine Learning Methods for Run-to-Run Control in High-Mix Semiconductor Manufacturing Processes
Lucile Terras | Mines Saint-Etienne
Break
Poster Presentation
Session Chair: Jochen Kinauer
Sensitivity Enhancement of Optical Signals for Plasma Etching Endpoint Detection with Modified Cluster Analysis Methods
Seonghyeon Lee | Sungkyunkwan University
An Enhanced Machine Learning Based Hybrid Metrology Approach Enabling APC in Oxide CMP
Dr. Zhuo Chen | Onto Innovation
Sensor Integration Framework with Interface A
Bert Müller | Kontron-AIS GmbH
Industrialization of statistical methods in form of a preproduction analysis tool
Valentin Germic | Elmos Semiconductor AG
Use of AI Computer Vision Methods and Edge Intel Industry 4.0 Framework in the Final Quality Control of Manufactured Kontron Industrial Computer
Maik Pertermann | Kontron-AIS GmbH
Towards the knowledge reuse in the semiconductor manufacturing industry AI Approaches: pitfall and tips
Houssam Razouk | Infineon Technologies Austria AG/ Graz University of Technology
Control of hybrid AMHS considering dynamic transport load transfers between vehicles
Patrick Boden | Technische Universität Dresden (online)
Smart Sensor Networks for Predictive Maintenance
Sebastian Rank | Technische Universität Dresden
Interface Optimization Potentials Concerning Disruptions along the Semiconductor Value Chain
Fabian Lindner | Hochschule Zittau/Görlitz
Exhibitor: Inficon GmbH
Exhibitor: Applied Materials
Exhibitor: MKS Instruments
Exhibitor: confovis GmbH
Exhibitor: camLine GmbH
Virtual Q&A | Chat Roulette
Poster Reception
Tuesday, April 05
Registration
Opening
Martin Schellenberger & Jochen Kinauer
Opening Talk
European Chips Act
Frank Bösenberg / Silicon Saxony
The European Chips Act will bolster Europe’s competitiveness and resilience in semiconductor technologies and applications, and help achieve both the digital and green transition. It will do this by strengthening Europe’s technological leadership in the field.
Invited Talk
Academic and industrial collaboration: Lighting the way to augmented decision for smarter manufacturing.
Philippe Vialetelle (ST) & Stephan Dauzere-Peres (EMSE)
Break
Session 1 | Part 2
Session Chair: Gerd Fischer
1.4 Improving a Grey Box Model of Current-Voltage Parameters for Optimization and Fault Detection of PERC Solar Cells
Dr. Matthias Müller | TU Bergakademie Freiberg / Institute of Applied Physics
1.5 Introducing a Sustainable, Request Driven Data Mining Model for Continuous Semiconductor Manufacturing Digitization
Dr. Christian Weber | University of Siegen
1.6 Chasing Abnormalities on Time Series for Predictive Maintenance and Advanced Process Control
Daniele Pagano | STMicroelectronics and Camille Girou | ippon innovation
Session 3 | Part 1
Session Chair: Christian Knöll
3.1 Artificial Intelligence for Real Time Cluster Tool Scheduling
Doug Suerich | PEER Group
3.2 Site Spanning Configuration of FDC
Daniel Zschäbitz | Infineon Technologies Dresden
3.3 ChatBot making factory and equipment alive, interactive and intelligent
Tan Soon Kai | camLine GmbH
Lunch
Session 1 | Part 3
Session Chair: Ulf Seidel
1.7 Machine learning in an SPC Framework drives productivity
Kalle Yla-Jarkko | camLine GmbH
1.8 Time Series Anomaly Detection in Batch Semiconductor Processes using Localised Reconstruction Errors from Semi-Supervised Convolutional AutoEncoders deployed as a Containerised Microservices Edge Solution
Mark Gorman | Seagate
1.9 On the detection threshold of One Class-Support Vector Machines used for out-of-control detection in semiconductor manufacturing
Ilham Rabhi PhD | Emse
1.10 Next Generation FDC Challenges for Smart Manufacturing
Jon Holt | PDF Solutions
Session 3 | Part 2
Session Chair: Christian Knöll
3.4 Productivity Infrastructure for Semiconductor Smart Manufacturing
Alan Weber | Cimetrix
3.5 Machine Health diagnostics of Semiconductor Facility equipment
Thomas Wagner | Technische Universität Dresden
3.6 Optimizing the Resist and Dedication Allocation for Capacity Maximisation in a Wafer Fabrication Plant
Peter Lendermann | D-SIMLAB Technologies
3.7 BIM as a modern method for smart fab planning and management
Dr. Torsten Thieme | DEAXO GmbH
Break
Session 1 | Part 4
Session Chair: Ulf Seidel
1.11 Ensemble Model for Robust, Explainable Thickness Prediction in Chemical Mechanical Polishing
Chloe Devine & Callum Canavan | Seagate Technology
1.12 Generalized approach for send ahead wafer automation
Dr. Robert Barlovic | GlobalFoundries
Session 2 | Part 2
Session Chair: Bert Müller
2.4 Chamber Clean Endpoint Detection with Quartz Crystal Microbalance (QCM) Sensors
Steven Lakeman | INFICON Inc.
2.5 Si-DRIE-Chamber condition in a mixed process use case
Erik Schumann | Fraunhofer IPMS
Virtual Q&A | Chat Roulette
Break
Conference Dinner
Sponsored by:
Wednesday, April 06
Registration
Opening
Martin Schellenberger & Jochen Kinauer
Invited Talk
Novel approach to master the challenges of run-to-run control in high-mix low-volume production
Ulf Seidel | Infineon Technologies Dresden
Session 1 | Part 5
Session Chair: Jochen Kinauer
1.13 Improvement of Semiconductor Master Data Quality Through Automated Detection of Semantic Similarities
Prof. Roland Willmann PhD | Carinthia University of Applied Sciences
1.14 1-2D-CNN-based Virtual Metrology Model with Explainable Feature Engineering
Kuen-Te Lee | National Taiwan University
Session 3 | Part 3
Session Chair: Christian Knöll
3.8 Smart Control System for Reduction of CO2 Emissions in SubFab Operation
Wolfgang Radloff | ADG Automatisierung Dresden GmbH
3.9. Leveraging a Comprehensive Fab Digital Twin to Quickly Improve Fab Performance
John Behnke | Inficon
Break
Session 1 | Part 6
Session Chair: Jochen Kinauer
1.15 Beyond the Passive Usage of Sensor Data: AI-based Advanced Sensor Applications
Feryel Zoghlami | Infineon Technologies Dresden
1.16 About humans and machines - the success factors on the way to Industry 4.h
Dr. Michael Schmeja | Virtual Vehicle Research GmbH
Session 1 | Part 7
Session Chair: Gerd Fischer
1.17 Yield Modelling (Prediction) enables Test Avoidance
Melvin Lee | Onto Innovation
SESSION 2 / PART 3
2.6 Optical Monitoring as a Tool to Maximize Reliability of Complex Optical Filters produced via Magnetron Sputtering
Dr. Stephan Mingels | Bühler Alzenau GmbH
Virtual Q&A | Chat Roulette
Closing
Martin Schellenberger & Jochen Kinauer