Agenda

Conference Program

Times of the agenda are in Central European Summer Time (CEST)

Tuesday, April 13

10:00 - 10:10

Conference Opening Session

Opening Remarks
Martin Schellenberger | Fraunhofer IISB
Jochen Kinauer | camline GmbH

10:10 - 10:40

Invited Talk

Fab of the Future: From lights-out manufacturing to robots and humans in the loop
Dirk Reichelt | University of Applied Science Dresden & Fraunhofer IWU

10:45 - 12:00

Session 1 - Part 1

Session Chair: Alan Weber

1.1 "Smart Virtual Collaboration to Optimize the Development Process in Semiconductor Industry"
Germar Schneider | Infineon Technologies

1.2 "Conflict Avoidance Strategies for Automated Guided Vehicles in Semiconductor Fabrication Facilities"
Karl-Benedikt Reith | TU Dresden

1.3 "Smart People Counting System"
Feryel Zoghlami | Infineon Technologies

Session 1 - Part 2

Session Chair: Gerd Fischer

1.4 "Real Time Data Display by Deployment of StreamSheets using FDC logfiles"
Dennis Föh | TDK-Micronas GmbH

 
1.5 "How to integrate an equipment into an existing software landscape using value driven development"
Max Prengemann | Kontron AIS

 
1.6 "Efficient Hook-Up for complex production systems"
Torsten Thieme | DEAXO GmbH

12:00 - 13:00

Lunch

13:00 - 14:15

Session 2 - Part 1

Session Chair: Jochen Kinauer

2.1 "Two new methods for process control which take into account big data context consequences"
Francois Bergeret | IPPON & Sabine Mercier | University of Toulouse Jean Jaurès

 
2.2 "Complementing a conventional FDC system with automatic fault detection: A case study"
James Bramante | INFICON

 

 
2.3 "Enhancing Design-relevant Document Search and Visibility through Fusion of Multi-sourced Data in Knowledge Graphs"
Hasan Abu Rasheed | Uni Siegen

Session 2 - Part 2

Session Chair: Gerald Rampf

2.4 "Scheduling by High Performance Computing An example for AGV considering dynamic transport carrier transfers"
Patrick Boden | TU Dresden



2.5 "To Enhance and Optimise Material Flow and Capacity Planning in Semiconductor Frontend Manufacturing: Simulate or Schedule?"
Peter Lendermann | D-Simlab

2.6 "Pattern Aware Scheduling for Improved Productivity and Product Quality"
Matthew Purdy | INFICON

14:15 - 14:30

Break

14:30 - 15:45

Session 3 - Part 1

Session Chair: Michael Klick

 
3.1 "Machine Learning for Virtual Metrology: A State-of-the-art Review"
Rebecca Clain | EMSE

3.2 "Enabling SPC OCAP Automation"
Dirk Wollstein | Globalfoundries


3.3 "Semiconductor Smart Manufacturing: An Evolving Nexus of Business Drivers, Technologies, and Standards"
Alan Weber | Cimetrix

Session 3 - Part 2

Session Chair: Martin Schellenberger

 
 


 
3.5 "Wafer cleaning in always smaller node sizes"
Ralf Emberger | SONOSYS


3.6 "Two Orders of Magnitude Beyond the Ordinary... Real-Time Application of Geometric Process Control"
Robert McCafferty | RHM Consulting

15:45 - 16:30

Poster Session / Poster Presentation

Poster

Wednesday, April 14

10:00 - 10:10

Opening Remarks

Martin Schellenberger | Fraunhofer IISB
Jochen Kinauer | camline GmbH

10:10 - 10:40

Invited Talk

Knowledge Management & Innovation in 4.x (.0 & h) industrial context: Moving QMS (Quality Management System) from "problem solving" toward "expandable rationality"

Stéphane Hubac | ST Microelectronics

10:45 - 12:00

Session 4 - Part 1

Session Chair: Christian Knoell

4.1 "Fault Detection and Classification with Temporal Convolutional Features"
Nick Huang | Uni Taiwan


4.2 "Why do I need a Digital Twin anyway?"
John Behnke | INFICON


 
4.3 "Machine learning for cluster tool throughput optimizat"
Doug Suerich | PEER Group

Session 4 - Part 2

Session Chair: Bert Müller

4.4 "APC for the Backend: Machine Learning for Automated Control of Manual Adjustments in Aluminum Wire Bonding
Felix Klingert | Fraunhofer IISB

4.5 "Automatic generation of APC Keynumbers based on anomaly detection for Al wire bonding"
Jan Papadoudis | Infineon Technologies

4.6 "Detection of Faulty Wire Bond Connects Causing Reliability Fails through Digitization & Analysis of Bond Tool Sensor Data"
Jon Holt | PDF Solutions

12:00 - 12:30

Break

12:30 - 13:45

Session 5 - Part 1

Session Chair: Ute Nehring

5.1 "The Benefits of Cloud Analytics in Semiconductor – A Real-time Application Case Study"
Max Zagrebnov | Bistel

5.2 "A Gaussian Process Regression Metamodel for Pattern Recognition in Current-Voltage Parameters of PERC Solar Cells"
Gerd Fischer | HSZG

5.3 "Advanced Gas and Chemical Distribution Management"
Stephane Allard | Camline

Session 5 - Part 2

Session Chair: Rupert Wagner

5.4 "CD and Etch Rate Prediction by plasma parameters including RF losses and chamber conditioning"
Michael Klick | Plasmetrex

5.5 "Towards Etch Chuck Failure Predictability"
Thomas Ashby | Imec

 

5.6 "Differential Pressure-based Mass Flow for Advanced Semiconductor Manufacturing"
Andrew Staudt | Brooks Instrument

13:45 - 13:55

Closing Remarks

Jochen Kinauer | camline GmbH
Martin Schellenberger | Fraunhofer IISB

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