Otto Graf | Robert Bosch Semiconductor Manufacturing Dresden
"Intelligent Fab – beyond I4.0"

Günter Schagerl | Infineon Technologies Austria AG

Otto Graf | Robert Bosch Semiconductor Manufacturing Dresden

Intelligent Fab – beyond I4.0

Portrait Otto GrafOtto Graf looks back on an extensive career in semiconductor manufacturing. The electrical engineer, a graduate of HTL Klagenfurt in Austria, gained in-depth knowledge of and hands-on experience with nearly every inch-size of wafer diameter (12” to 4”) and a wide range of semiconductor technologies with a special focus on Memory, ASIC, PowerMOS and MEMS. Currently, Otto Graf is the project leader responsible for the construction of Bosch’s first 300 mm wafer FAB and acts as managing director of “Robert Bosch Semiconductor Manufacturing Dresden GmbH”.Before joining Robert Bosch GmbH in 2017, Otto Graf was the COO for the business groups “aluminum capacitors” and “systems, acoustics, waves” at TDK Epcos.  Prior to this position, from 1992 until 2012, he held different positions at the Siemens and later Infineon Technologies semiconductor facilities in Villach and Regensburg covering the complete range of production management at both locations. Additionally, he was a deputy member of the Executive Board at Infineon Technologies between 2008 and 2012. In his first professional experience in 1991, Otto Graf led a project team in developing a 16MB memory chip (8”) in a joint IBM-Siemens cooperation.