Call for Papers

This year´s conference features four technical session on:

Process Level APC
Manufacturing Effectiveness
Smart Manufacturing
Packaging & Smart Integration

and a special Session on "Shaping Europe’s Future – Competitive & Sustainable Chip Fabs".

The Call for Papers for apc|m 2026 is open from September until December 31, 2025. We invite contributions from industry and academia on all aspects of advanced process control and manufacturing effectiveness in the semiconductor and related industries.

Submission Guidelines:

Please fill out the Word “Abstract Master” in advance.
Have a speaker photo ready.
Then go to the submission tool Sessionize and submit your contribution.
All submissions must be made via Sessionize – please prepare your materials before starting the submission process.

Abstract master

Abstract Master: Special Session

At apc|m, you have the opportunity to showcase your topics, products, solutions, and innovations to an engaged audience of specialists. Engage with potential clients and partners in the comfortable setting of a ambiance, set against the backdrop of one of Europe's most picturesque cities.

PREPARE YOUR ABSTRACT

We explicitly call for abstracts that cover the practical application of data analytics and AI in semiconductor manufacturing, for example in one of the following domains:

Black Box vs. grey box vs. white box – how to combine engineers’ knowledge with ML / AI methods
Combining artificial intelligence with human intelligence (“Industry 4.h”) to accelerate learning and to apply best practices (e.g., process learning, smart repair, …)
Experiences in using data lakes vs. legacy data base systems
How to foster collaboration with universities and external partners by trustful data exchange, e.g., via (public) cloud platforms

Abstract form

SUBMIT YOUR ABSTRACT FORM

Submit now!

Special Session: Shaping Europe’s Future – Competitive & Sustainable Chip Fabs

The European chip industry is entering a decisive phase. Our shared goal is to make it competitive, sustainable and capable of high-volume production.

As part of the well-established apc|m Conference, this additional session will introduce an exciting, forward-looking perspective for modern, high-volume European fabs. Take this opportunity to present your ideas and innovations in this context.

Why should you participate?

Showcase how your work contributes to the future of the European semiconductor industry
Discuss challenges and solutions with leading experts
Bring your innovations into the conversation and actively shape progress

Please, use the separate "Abstract Form - Special Session" to submit your abstract for this session.

Young Talent Award

Are you at the beginning of your career, writing your thesis or have you completed an exciting scientific project dealing with current challenges and future needs in advanced process control or increasing efficiency in production? We are looking for abstracts that cover the practical application of data analytics and AI in semiconductor manufacturing.

Submit your abstract by 14 December 2024!

What's in it for your:

Chance to win award incl. 500 € & certificate
Present your innovative topic to a high-level audience
Exclusive opportunity: only six abstracts will be selected
Selected talents receive free access to the conference
Immerse yourself in the dynamic industry landscape
Network with like-minded people and advance your career

In 2024, Hossam Elwan won the award for his work on "CMP Process Modelling using Machine Learning Techniques".

Young Talent Award 2024

APC|M TOPICS

Process Level APC

Plasma Based Deposition (PVD, PE-CVD and PE-ALD)
Plasma etching for Si and compound materials (RIE)
Classical Deposition (CVD, ALD)
Plating
Lithography & Lithography logistic
Thermal, WET
CMP
Epitaxy
Other unit processes
Metrology, virtual metrology
Defect Density Engineering
Process modelling, simulation, digital twin
Process control methods at process level, e.g., FDC, Fault Prediction, Run-to-Run Control, Virtual Metrology

Smart Manufacturing

Digitization, data analytics
Data quality
Machine learning & AI
Digital twin
Fab level process control methods, R2R
Yield management
Factory data analysis
Equipment integration
IT infrastructure, IoT, edge-devices, cloud-based systems, quantum computing
Cybersecurity, data sharing, conversion techniques and blockchain
Fab level process control methods, e.g., FDC, Fault Prediction, Run-to-Run Control, Virtual Metrology

Manufacturing Effectiveness

Equipment productivity
Manufacturing productivity and automation
Factory modeling and simulation
Supply chain integration and optimization
Cost management
End-of-life equipment challenges
Material efficiency
Environment and green manufacturing
Industry standards, requirements, future needs and roadmaps

Packaging & Smart Integration

Backend and final test
Heterogenous Integration
APC and smart manufacturing solutions in other precision industries such as electronics, pharmaceutical, chemical

Deadlines

Abstract guidelines and submission

Abstract submission: December 14, 2024
Abstract acceptance: February 14, 2025
Program announcement: February 19, 2025