Conference Topics

Plasma etch, CVD and ALD

• Chamber & process characterization (tool health, EEQA, finger printing, chamber matching), process models & model based sensors, dry clean, first wafer / wafer sequence effects effects, FDC (fault prediction), tool level APC, spare part assessment & qualification

Sputtering, P3I, and e--beam

• Chamber & processes characterization (tool health, EEQA, finger printing, chamber matching), spare part assessment & qualification, tool level APC, arcing

Lithography

• Exposure tools, coater & developer tracks, tool level APC, within wafer / within die close control

Thermal, wet processing & CMP

• EEQA and finger printing, RTP

Backend

• APC for testing, die bonding, wire bonding, plating, molding

Metrology and R2R

• Virtual, inline and offline metrology, soft sensors principles, large-area metrology

APC for legacy tools

• Hardware & software modifications, integration into existing APC systems, sensor integration
  
  

Fab level process control methods

• Run-to-run and wafer-to-wafer control, realtime control, control algorithms, defect inspection, test structures (wafer), sampling strategy

Virtual metrology

• Application of process models, control density improvement, reduction of measurement operations and non-product wafers, throughput increase

Yield management

• Prediction and improvement of product parameters and yield by use of APC methods, novel methods of yield modeling and management

Factory data analysis

• Real-time data collection aggregation, classification and quality, process and equipment
  capability, mathematical methods and model creation, novel methods of data visualization
  and data analysis

IT infrastructure

• Tool interfaces and communication, sensor / actuator bus, interfaces, demands on new standards

Unit process & equipment productivity

• Throughput and uptime improvement, cycle time and variability reduction, non-productive wafer and substrate reduction, tool and unit process related productivity improvement

Factory productivity and automation

• Factory scheduling and dispatching optimization, throughput and uptime improvement, cycle time and variability reduction, automation-related productivity improvement, master data management, tracking of materials, spare parts and consumables, production planning & control, wafer handling, maintenance strategy, lean manufacturing

Factory modeling, simulation and optimization

• Design for manufacturing, future factory design, capacity and cost modeling, yield modeling & improvement, novel methods of manufacturing data analysis and visualization

Cost optimization and end-of-life equipment issues

• Fixed and variable cost reduction, cost of ownership (CoO) and overall equipment efficiency (OEE), unit cost modelling, equipment and maintenance optimization

Environment and Green Manufacturing

• Global ESH strategies, facilities operations, facility systems reliability improvements, manufacturing sustainability and resource conservation