Conference Topics

Plasma Based Deposition (PVD, PE-CVD and PE-ALD) 

• Chamber & process characterization (tool health, EEQA, finger printing, chamber matching), process models & model based sensors, dry clean, first wafer / wafer sequence effects, FDC (fault prediction), tool level APC, spare part assessment & qualification. 

Plasma etching for Si and compound materials (RIE) 

• Chamber & process characterization (tool health, EEQA, finger printing, chamber matching), process models & model based sensors, dry clean, first wafer / wafer sequence effects, FDC (fault prediction), tool level APC, spare part assessment & qualification. 

Classical Deposition (CVD, ALD) 

• Chamber & process characterization (tool health, EEQA, finger printing, chamber matching), process models & model based sensors, dry clean, first wafer / wafer sequence effects, FDC (fault prediction), tool level APC, spare part assessment & qualification. 

Plating

• Chamber & process characterization, tool level APC, spare part assessment & qualification, process control for electrochemical deposition and plating processes. 

Lithography & Lithography logistic 

• Exposure tools, coater & developer tracks, tool level APC, within wafer / within die close control, logistics and scheduling for lithography processes. 

Thermal, WET 

• EEQA and finger printing, RTP, process control and monitoring for thermal and wet chemical processes. 

CMP 

• Process control and monitoring for chemical mechanical planarization, including EEQA, finger printing, and tool health assessment. 

Epitaxy 

• Chamber & process characterization, process models, tool level APC, and control strategies for epitaxial growth processes. 

Other unit processes 

• APC and process control strategies for additional unit processes not covered in the above categories. 

Metrology, virtual metrology 

• Virtual, inline and offline metrology, soft sensors principles, large-area metrology. 

Defect Density Engineering 

• Methods and strategies for monitoring, controlling, and reducing defect density throughout the manufacturing process. 

Process modelling, simulation, digital twin 

• Development and application of process models, simulation techniques, and digital twins for process optimization and control. 

Process control methods at process level, e.g., FDC, Fault Prediction, Run-to-Run Control, Virtual Metrology 

• Advanced process control methods at the process level, including FDC (fault detection and classification), fault prediction, run-to-run control, and virtual metrology. 

Digitization, data analytics 

• Digital transformation and data-based analysis methods for optimizing manufacturing processes and decision-making. 

Data quality 

• Methods for ensuring, monitoring, and improving data quality in semiconductor manufacturing. 

Machine learning & AI 

• Application of machine learning and artificial intelligence for process optimization, error detection, and automation. 

Digital twin 

• Use of digital twins to simulate, monitor, and optimize manufacturing processes and plants. 

Fab level process control methods, R2R 

• Fab level process control methods: Run-to-run and wafer-to-wafer control, realtime control, control algorithms, defect inspection, test structures (wafer), sampling strategy. 

Yield management 

• Prediction and improvement of product parameters and yield by use of APC methods, novel methods of yield modeling and management. 

Factory data analysis 

• Real-time data collection aggregation, classification and quality, process and equipment capability, mathematical methods and model creation, novel methods of data visualization and data analysis. 

Equipment integration 

• Integration and networking of production facilities, interface management, and automation solutions for efficient production.

IT infrastructure, IoT, edge-devices, cloud-based systems, quantum computing 

• Tool interfaces and communication, sensor/actuator bus, interfaces, requirements for new standards. Expansion to include IoT, edge devices, cloud-based systems, and quantum computing for innovative IT infrastructures.

Cybersecurity, data sharing, conversion techniques and blockchain 

• Strategies and technologies for ensuring data security, secure data exchange, data conversion, and the use of blockchain in manufacturing.

Fab level process control methods, e.g., FDC, Fault Prediction, Run-to-Run Control, Virtual Metrology 

• Advanced process control methods at the fab level, including FDC (fault detection and classification), fault prediction, run-to-run control, and virtual metrology. 

Equipment productivity 

• Throughput and uptime improvement, cycle time and variability reduction, non-productive wafer and substrate reduction, tool and unit process related productivity improvement. 

Manufacturing productivity and automation 

• Factory scheduling and dispatching optimization, throughput and uptime improvement, cycle time and variability reduction, automation-related productivity improvement, master data management, tracking of materials, spare parts and consumables, production planning & control, wafer handling, maintenance strategy, lean manufacturing. 

Factory modeling and simulation 

• Design for manufacturing, future factory design, capacity and cost modeling, yield modeling & improvement, novel methods of manufacturing data analysis and visualization

Supply chain integration and optimization 

• Integration, control, and optimization of the supply chain to ensure efficient, flexible, and resilient material and information supply.

Cost management 

• Fixed and variable cost reduction, cost of ownership (CoO) and overall equipment efficiency (OEE), unit cost modelling, equipment and maintenance optimization. 

End-of-life equipment challenges 

• Strategies and solutions for dealing with aging assets, including maintenance, spare parts management, retrofitting, and sustainable decommissioning.

Material efficiency 

• Reduction of material consumption and waste, optimization of material flows and resource use to increase efficiency and sustainability.

Environment and green manufacturing 

• Global ESH strategies, facilities operations, facility systems reliability improvements, manufacturing sustainability and resource conservation. 

Industry standards, requirements, future needs and roadmaps 

• Development, implementation, and adaptation of industry standards, consideration of future requirements, and creation of roadmaps for semiconductor manufacturing. 

Backend and final test 

• APC methods and process control for backend processes, including assembly, packaging, and final testing to ensure product quality and reliability. 

Heterogenous Integration 

• Innovative approaches for integrating diverse materials, components, and technologies (e.g., 2.5D/3D integration, chiplets, SiP) to enable high-performance and flexible system solutions. 

APC and smart manufacturing solutions in other precision industries such as electronics, pharmaceutical, chemical 

• Application of Advanced Process Control (APC) and smart manufacturing solutions in other precision industries—such as electronics, pharmaceutical, and chemical—to enhance efficiency, quality, and automation.