Call for Papers

The call for papers is closed. The program is currently being finalized and will soon be available on the homepage.

At apc|m, you have the opportunity to showcase your topics, products, solutions, and innovations to an engaged audience of specialists. Engage with potential clients and partners in the comfortable setting of a ambiance, set against the backdrop of one of Europe's most picturesque cities.

PREPARE YOUR ABSTRACT

We explicitly call for abstracts that cover the practical application of data analytics and AI in semiconductor manufacturing, for example in one of the following domains:

Black Box vs. grey box vs. white box – how to combine engineers’ knowledge with ML / AI methods
Combining artificial intelligence with human intelligence (“Industry 4.h”) to accelerate learning and to apply best practices (e.g., process learning, smart repair, …)
Experiences in using data lakes vs. legacy data base systems
How to foster collaboration with universities and external partners by trustful data exchange, e.g., via (public) cloud platforms

Abstract form

SUBMIT YOUR ABSTRACT FORM

Young Talent Award

Are you at the beginning of your career, writing your thesis or have you completed an exciting scientific project dealing with current challenges and future needs in advanced process control or increasing efficiency in production? We are looking for abstracts that cover the practical application of data analytics and AI in semiconductor manufacturing.

Submit your abstract by 14 December 2024!

What's in it for your:

Chance to win award incl. 500 € & certificate
Present your innovative topic to a high-level audience
Exclusive opportunity: only six abstracts will be selected
Selected talents receive free access to the conference
Immerse yourself in the dynamic industry landscape
Network with like-minded people and advance your career

In 2024, Hossam Elwan won the award for his work on "CMP Process Modelling using Machine Learning Techniques".

Young Talent Award 2024

APC|M TOPICS

Process Level APC

Plasma etch, CVD and ALD
Sputtering, P3I, and e--beamLithography
Thermal, wet processing & CMP
Backend
Metrology and R2R
APC for legacy tools

Fab Level APC

Digitization, data analytics, machine learning & AI, digital twin
Fab level process control methods
Virtual metrology
Yield management
Factory data analysis
IT infrastructure & Equipment integration trends

Manufacturing Effectiveness and Productivity

Unit process & equipment productivity
Factory productivity and automation
Factory modeling, simulation and optimization
Cost optimization and end-of-life equipment issues
IT infrastructure & Equipment integration trends

Deadlines

Abstract guidelines and submission

Abstract submission: December 14, 2024
Abstract acceptance: February 14, 2025
Program announcement: February 19, 2025