Call for Papers
At apc|m, you have the opportunity to showcase your topics, products, solutions, and innovations to an engaged audience of specialists. Engage with potential clients and partners in the comfortable setting of a ambiance, set against the backdrop of one of Europe's most picturesque cities.
We explicitly call for abstracts that cover the practical application of data analytics and AI in semiconductor manufacturing, for example in one of the following domains:
- Black Box vs. grey box vs. white box – how to combine engineers’ knowledge with ML / AI methods
- Combining artificial intelligence with human intelligence (“Industry 4.h”) to accelerate learning and to apply best practices (e.g., process learning, smart repair, …)
- Experiences in using data lakes vs. legacy data base systems
- How to foster collaboration with universities and external partners by trustful data exchange, e.g., via (public) cloud platforms
Young Talent Award
Are you at the beginning of your career, writing your thesis or have you completed an exciting scientific project dealing with current challenges and future needs in advanced process control or increasing efficiency in production? We are looking for abstracts that cover the practical application of data analytics and AI in semiconductor manufacturing.
Submit your abstract by 14 December 2024!
What's in it for your:
- Chance to win award incl. 500 € & certificate
- Present your innovative topic to a high-level audience
- Exclusive opportunity: only six abstracts will be selected
- Selected talents receive free access to the conference
- Immerse yourself in the dynamic industry landscape
- Network with like-minded people and advance your career
In 2024, Hossam Elwan won the award for his work on "CMP Process Modelling using Machine Learning Techniques".
Young Talent Award 2024
APC|M TOPICS
Process Level APC
- Plasma etch, CVD and ALD
- Sputtering, P3I, and e--beamLithography
- Thermal, wet processing & CMP
- Backend
- Metrology and R2R
- APC for legacy tools
Fab Level APC
- Digitization, data analytics, machine learning & AI, digital twin
- Fab level process control methods
- Virtual metrology
- Yield management
- Factory data analysis
- IT infrastructure & Equipment integration trends
Manufacturing Effectiveness and Productivity
- Unit process & equipment productivity
- Factory productivity and automation
- Factory modeling, simulation and optimization
- Cost optimization and end-of-life equipment issues
- IT infrastructure & Equipment integration trends
Deadlines
Abstract guidelines and submission
Abstract submission: December 14, 2024
Abstract acceptance: January 15, 2025
Program announcement: January 30, 2025