| 101 |
Implementation of a simple RF related FDC strategy on AMAT Producer DXZ chambers to ensure a controlled process environment |
Armin Domitner |
ams AG |
| 103 |
Sensitivity Enhancement of Optical Signals for Plasma Etching Endpoint Detection with Discrete Wavelet Transform and Machine Learning |
Seonghyeon Lee |
Sungkyunkwan university Nanoscale Processing Lab |
| 104 |
PECVD NEEDs Deposition Rate Control in Production |
Lutz Eichhorn |
Plasmetrex |
| 105 |
Enhanced PVD Preclean process control by combining SPC equipment checks with inline etch rate calculation by FDC |
Christina Wappl |
ams AG |
| 201 |
Equipment Integration within minutes |
Bert Müller |
Kontron AIS GmbH |
| 202 |
Wafer defect map classification using convolutional neural network |
Irene Bianchi |
ST Microelectronics |
| 203 |
Overcoming Root Cause Analysis Challenges with Trace Analytics |
Max Zagrebnov |
BISTel America |
| 204 |
Common Data Extraction Layer for Root Cause Investigation in Semiconductor FAB |
Peter Czerner |
Elmos Semiconductor AG |
| 205 |
Root Cause and Split Group Investigation for One-Lot-Anomalies as Method Set and Tool |
Peter Czerner |
Elmos Semiconductor AG |
| 301 |
Development and evaluation of a Blockchain concept for the IFD 300 mm Pre-Assembly Line |
Germar Schneider |
Infineon Technologies Dresden GmbH & Co. KG |
| 302 |
Vibration Measurement and Visualization in Semiconductor AMHS |
Thomas Wagner |
TU Dresden |
