Accepted Posters

Poster Titel Presented by Company
101 Implementation of a simple RF related FDC strategy on AMAT Producer DXZ chambers to ensure a controlled process environment Armin Domitner ams AG
103 Sensitivity Enhancement of Optical Signals for Plasma Etching Endpoint Detection with Discrete Wavelet Transform and Machine Learning Seonghyeon Lee Sungkyunkwan university Nanoscale Processing Lab
104 PECVD NEEDs Deposition Rate Control in Production Lutz Eichhorn Plasmetrex
105 Enhanced PVD Preclean process control by combining SPC equipment checks with inline etch rate calculation by FDC Christina Wappl ams AG
201 Equipment Integration within minutes Bert Müller Kontron AIS GmbH
202 Wafer defect map classification using convolutional neural network Irene Bianchi ST Microelectronics
203 Overcoming Root Cause Analysis Challenges with Trace Analytics Max Zagrebnov BISTel America
204 Common Data Extraction Layer for Root Cause Investigation in Semiconductor FAB Peter Czerner Elmos Semiconductor AG
205 Root Cause and Split Group Investigation for One-Lot-Anomalies as Method Set and Tool Peter Czerner Elmos Semiconductor AG
301 Development and evaluation of a Blockchain concept for the IFD 300 mm Pre-Assembly Line Germar Schneider Infineon Technologies Dresden GmbH & Co. KG
302 Vibration Measurement and Visualization in Semiconductor AMHS Thomas Wagner TU Dresden