Session chair: Bert Müller
Company: Kolja Haberland | LayTec AG
Title: Robust and automatic dual wavelength-based endpointing for consistent batch-to-batch plasma etching of InP-based lasers
Company: Michael Klick | Plasmetrex GmbH
Title: Fault Classification for Deep Si Etch
Company: Zimeng Wang | Eindhoven University of Technology
Title: Endpoint detection of plasma etching in small open area based on feature extraction and trend identification
Company: Jianping Zou | Applied Materials Inc.
Title: A Model Based Method of Non-Threaded R2R Control with Expectation-Maximization (EM) Optimization
Session sponsored by:
