Agenda
Session Chair: Ulf Seidel
10:30 - 11:00
Unit process & equipment productivity shock sentinel on evg wtw bonding system robot handling
Marco Cartotti | STMicroelectronics & Daniele Lavalle | Technofitting
11:00 - 11:30
New generation of equipment/host communication as an enabler for data platforms, AI and digital twin
Marco Grafe | Carl Zeiss Digital Innovation GmbH
11:30 - 12:00
Digitalisation & AI for Industry 5.0 Applications to Make Semiconductor Manufacturing Sustainable
Germar Schneider | Infineon Technologies Dresden Gmbh & Co. KG
12:00 - 12:30
From dispatching to autonomous scheduling: a case study at a real wafer fab
Semya Elaoud | Flexciton Ltd.