Conference
Agenda
The conference program is organized with presentations/talks and poster sessions in parallel. Additionally, several half-day technical tutorials will be offered to you.
The conference will be an excellent opportunity to promote your company's products.
Usergroup Meetings are an easy way to meet your customers. The schedule of events will provide plenty of time to get in contact with your colleagues, customers and suppliers.
Monday, April 10
Registration
Tutorials
Tutorial 1: Introduction to APC
Klaus Kabitzsch | TU Dresden
Tutorial 2: Control of Complex Processes in Semiconductor Manufacturing - Physical and Process Models
Michael Klick | Plasmetrex GmbH
Plasma Supervision Workshop
One man's opinion
Opening Session
Session Chair: Klaus Kabitzsch
13:40 | Opening RemarksKlaus Kabitzsch | TU Dresden |
13:50 | Welcome AddressMary Mitchell O’Connor | Minister of Jobs, Enterprise and Innovation - Irish Government |
14:00 | Welcome AddressTommy Fanning | IDA |
14:10 | KeynoteSuccess factors for semiconductor manufacturing in high cost locationsThomas Morgenstern | Robert Bosch GmbH |
14:40 | Invided TalkIoT's connected devices and big data Analytics: The opportunities and challenges in semiconductor manufacturingNiall Macgearailt | Intel |
Break
Session 1 - Part 1
Session Chair: Niall Macgearailt
1.1 Waferflow analysis for cluster tools by prime number mapping (PNM)
Dennis Föh | TDK-Micronas
1.2 Run to Run Control of a Vacuum Dielectric Deposition Tool using Key Process Input Variable Data from Tool Sensors
Brendan Doherty | Seagate Technology
1.3 Advanced Process Control for Laser Production in Compound Semiconductor Epitaxy
Kolja Haberland | LayTec AG
Session Sponsor: 
Session 2 - Part 1
Session Chair: Alan Weber
2.1 Advanced Automation of Decision Making Process Flows of Manufacturing Support Processes in the High Tech Industry
Germar Schneider | Infineon Technologies Dresden GmbH
Sophia Keil | Dresden University of Technology
2.2 Enabling the reuse and orchestration of simulation models
Thomas Wagner | Dresden University of Technology
2.3 Real-Time Reporting data as a single source for simulation model generation
Mike Gißrau | SYSTEMA GmbH
Poster & Exhibitor Presentation
Reception, Poster & Exhibition
Tuesday, April 11
Registration
Opening Session
Session Chair: Michael Klick
09:00 | Opening RemarksMichael Klick | Plasmetrex |
09:10 | KeynoteFDC control, the loop between standardization and innovationMichel Derie | ST Microelectronics |
09:40 | Invided TalkAutomating Analytics for Cognitive IoTJörn Plönnigs | IBM Research |
Break
Session 1 - Part 2
Session Chair: Johann W. Bartha
1.4 Overlay budget improvement in TFH manufacturing through improved metrology
Ronny Haupt | KLA-Tencor
1.5 Equipment Deterioration Prognosis and Fault Diagnosis in Semiconductor Manufacturing
Jakey Blue | Ecole des Mines Saint Etienne
1.6 APC for the backend: Influences of quality-relevant manual adjustments in aluminum wire bonding equipment
Felix Klingert | Fraunhofer IISB
1.7 Multivariate Process Diagnostics: Requirements, Results and Challenges in the Semiconductor Industry
Michael Tiernan | Intel Ireland
Session Sponsor:
Session 4 - Part 1
Session Chair: Klaus Kabitzsch
4.1 Application of constrained least squares fitting to run-to-run control
Ulf Seidel Infineon Technologies Dresden
4.2 "Wafer at Risk" control: a methodology to prevent excursion and to limit wafer failure
Mario Francesco Pistoni | ST Microelectronics
4.3 MVA Analysis Flow for FDC Data
Jacob Orbon | Rudolph Technologies
4.4 Predictive Analytics for Semiconductor Process Equipment
Richard Beaver | Rudolph Technologies
Lunch Break
Session 3
Session Chair: Dennis Föh
3.1 Chamber Conditioning Effects Characterized by Means of Complementary Sensors
Michael Klick | Plasmetrex GmbH
3.2 Novel Process Characterization and Control for TiN/Al/TiN on Advanced Memory Manufacturing
Tony Hsieh | Applied Materials
3.3 Power or Voltage Mode for Triode Etching
Johann W. Bartha | TU Dresden
3.4 E-H-Mode Detection and Chamber Comparison in Lam Versus 2300
Michael Klick | Plasmetrex GmbH
Session 4 - Part 2
Session Chair: Ulf Seidel
4.5 Electrical Die Yield improvement plan based on defectivity equipment reduction: focus on edge of wafer impact
Daniel DECROIX | ST Microlectronics
4.6 Advanced Dynamical Control for Super Junction MOSFET technology with parallel coordinates
Marco Bagagiolo | ST Microelectronics
Robert H. McCafferty | RHM Consulting
4.8 Practical Machine Learning in Semiconductor
Jim Redman | ErgoTech Systems
4.10 FDC multivariate anomaly detection through Support Vector Machine algorithm implementation
Daniele Riccardo Vinciguerra | ST Microelectronics
Break
Session 2 - Part 2
Session Chair: Gerald Rampf
2.4 Smarter Manufacturing Using SEMI Standards: Practical Approaches for "Plug and Play" Application Integration
Alan Weber | Cimetrix, Inc.
2.5 How to Fully Capitalize on Advanced Process Control through a Quality Management System
Werner Bergholz | Q-TEAM and International Standards Consulting GmbH
Break and Transfer to Conference Dinner
Conference Dinner
Wednesday, April 12
Registration
Opening Session
Session Chair: Michael Klick
| 09:00 | Opening RemarksMichael Klick | Plasmetrex |
| 09:10 | KeynoteSmart ManufacturingRichard Beaver | Rudolph Technologies |
| 09:40 | Invited TalkAdvancements in FDC: Reducing False Alarms and Optimizing Model and Limits ManagementJames Moyne | Applied Materials |
Break
Session 2 - Part 3
Session Chair: Sophia Keil
2.6 Automated-generated long-term production simulation model for semiconductor industry
Thomas Wagner | Dresden University of Technology
2.7 Vibration Monitoring of a Wafer Transport System with FDC
Andreas Feustel | Robert Bosch GmbH
2.8 Post-Maintenance Tool Qualification via Automated Restrictive Dispatch and Verification
Trent McKay | Seagate Technology
2.9 A Fab-Wide Application validating Tool Qualification while interacting with CMMS / MES / APC (RtR/FDC/SPC) Systems
André Holfeld | GLOBALFOUNDRIES
Session 4 - Part 3
Session Chair: Michael Klick
4.11 A Novel Approach to Fault Detection Using Full Sensor Trace Analytic
Tom Ho | BISTel America
4.12 Integrate APC into your Recipe Management
Jochen Kinauer | camLine GmbH
4.13 Repeated Spatial Pattern Detection in Thin Film Fabrication using Unsupervised Clustering & Feature Extraction
Paul Beales | Seagate Technology
4.14 Non-contact metal layer thickness and sheet resistance measurement on process wafers for yield increase through near edge monitoring
Marcus Klein | SURAGUS GmbH
Closing Remarks
Klaus Kabitzsch