Conference 2014


The conference program is organized with presentations/talks and poster sessions in parallel. Additionally, several half-day technical tutorials will be offered to you.

The conference will be an excellent opportunity to promote your company's products.

Usergroup Meetings are an easy way to meet your customers. The schedule of events will provide plenty of time to get in contact with your colleagues, customers and suppliers.

Monday, April 07

8:00 - 9:00


9:00 - 12:30


Tutorial: Introduction to APC

1. Introduction (Roland Willmann - Peergroup)
2. APC for Isolated Process Steps (Klaus Kabitzsch - TU Dresden)
3. APC for Complex Processes (Michael Klick - plasmetrex)
4. APC on Fab Level (Roland Willmann - Peergroup)

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12:30 - 14:00

Lunch Break

14:00 - 14:10

Opening Session

Klaus Kabitzsch - Dresden University of Technology

14:10 - 14:20

Welcome Address

Sergio Galbiati - President of LFoundry Italy and Co-CEO

Sergio completed his degree in Physics in 1976 at the University of Milan and began working in the semiconductor industry in 1977, in SGS-Thompson (current ST Microelectronics). In 1989 he moved to Texas Instruments, being part of the project to start-up the new Avezzano’s fab. He became responsible of the Operation in 1993. In 1998 he assumed the role of General Manager of the Abruzzo site, after the site acquisition by Micron Technology. In April 2010, Sergio becomes the Country Manager of Micron in Italy, which was present in five Italian regions with Operations, Business Units, R&D and support activities. Since May 2013 he is appointed as President of LFoundry Italy and Co-CEO.

14:25 - 14:55

Keynote 1

Roberto Zafalon - STMicroelectronics
“The Renaissance of Nanoelectronics and Smart Systems industry: More than Moore in the Italian eco-system”

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14:55 - 15:40

Invited Talk 1

Steffen Meyer - ASML
"Improving lithography performance with advanced control loops fueled by integrated metrology"

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15:40 - 16:10


16:10 - 17:10

Session 1

Session Chair: Martin Schellenberger

"Process Control Monitoring Improvements using a fab level metrology APC application"

André Gellrich, Dresden University of Technology
"Sense and React in Future Factory Automation"

17:10 - 17:50
17:50 - 19:00

Tuesday, April 08

8:00 - 9:00


9:00 - 9:10


Michael Klick - Plasmetrex

9:10 - 9:40

Keynote 2

9:40 - 10:15

Invited Talk 2

Michael Liehr, CNSE
 "At a crossroads in scaling"

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10:15 - 11:15

Session 2

Session Chair: Gerd Fischer

James Moyne, Applied Materials
"The International Technology Roadmap for Semiconductor Manufacturing’s (ITRS) Big Data Roadmap"

Klaus Sandtner, Infineon Technologies Austria AG
"Visualization of the Lot Flow in a Semiconductor Power Fab with High Complexity"

11:15 - 11:45


11:45 - 13:15

Session 2

Session Chair: Jochen Kinauer

Peter Henoeckl, Infineon Technologies Austria AG
"Factory Integrated Robotic Effector - An Autonomous Robotic System for Handling Wafer Cassettes"

Cristina De Luca, Infineon Technologies Austria AG
"A Look into the Future of Enabling 300mm Power Technologies and Automation Challenges"    

Jan Driessen, NXP Semiconductors
"WAIT-TIME-WASTE opportunities in SECS/GEM-based 200mm fabs (INTEGRATE)"   

Session 3

Session Chair: James Moyne

Georg Roeder, Fraunhofer IISB
"Application of Virtual Metrology Techniques to combine Process Information from DOEs and individual Experiments performed during Equipment Assessment"    
Paolo Ciotti, Marsica Innovation & Technology S.r.l.
"An Adaptive Exponential Weighted Moving Average Filter for Overlay Correction in Photolithography"    
Alexander Tobisch, Fraunhofer IISB
"Optical metrology for full-field wafer nanotopography inspection"

13:15 - 14:40


14:40 - 16:10

Session 2

Session Chair: Robert McCafferty

Thomas Wagner, Dresden University of Technology
"Automatic Generation of Simulation Models of Automated Material Handling Systems in Semiconductor Manufacturing"    

Bert Müller, AIS Automation Dresden GmbH
"Flexible Total Cost of Ownership Calculation (TCO) tool to calculate and plan manufacturing lines with Open Source Software Technologies"    
Alan Weber, Cimetrix
"Analyzing Event Data: Where Does All the Time Go?"   

Session 4

Session Chair: Frederic Lafaye de Micheaux

Peter Scheibelhofer, ams AG
"Applied Multivariate Monitoring of Wafer Acceptance Tests"    

Robert H. McCafferty, RHM Consulting
"First wafer effect on epitaxial reactors with parallel coordinate visualization"    

Gerd Fischer, SolarWorld Innovations GmbH
"Yield Enhancement in Advanced Silicon Photovoltaic Production based on TCAD Device Simulation and Statistical Analysis"

16:10 - 17:10

Break and Postersession

17:10 - 18:40

Session 2

Session Chair: Alan Weber

 André Wenzel, Dresden University of Technology
"Exploring the effects of lot size on cycle time and throughput in semiconductor industry – an empirical study"    

Israel Tirkel, Ben-Gurion University of the Negev
"The Impact of Variability on Cycle Time Reduction"    

Mike Gißrau, X-FAB Dresden
"The influence of human operations on the factory performance of a high-mix low-volume ASIC facility – A case study"   

Session 4

Session Chair: Jan Räbiger

Sang-Ho Lee, Samsung Electronic
"Semiconductor Equipment Sensor Data Analysis for Yield Enhancement: How to Deal with Big-Data?"    

Eric McCormick, TriQuint Semiconductor, Inc.
"How to implement an FDC system successfully – A methodical approach with a framework of tools in data collection, data summarization, data mining, univariate FDC and multivariate FDC modeling."    

Roland Willmann, PEERGroup GmbH
"Fast Machine Ramp-up Through a Comprehensive Equipment Automation Platform"   

18:40 - 19:10


19:10 - 22:00

Sightseeing and Conference Dinner

Wednesday, April 09

8:30 - 9:00


9:00 - 9:10


Michael Klick - Plasmetrex

9:10 - 9:40

Keynote 3

Andreas Wild, Executive Director ENIAC Joint Undertaking
"Innovation Priorities in ECSEL JU"

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9:40 - 10:20

Invited Talk 3

Sophia Keil, Dresden University of Technology
Managing Complexity in Mature Multi-Product Semiconductor Fabrication Facilities

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10:20 - 10:30

Information apc|m 2015

Dr. Thomas Zwack , Texas Instruments

10:30 - 11:00

Guest Talk from AEC/APC ASIA

Tomoya Tanaka, Panasonic Corporation
"Improvement of Overall Equipment Efficiency by Virtual Metrology using Equipment data in Reactive Sputtering of Titanium Nitrid"

11:00 - 11:30


11:30 - 13:30

Session 1 - continue

Session Chair: Roland Willmann

Kenneth Harris, PDF Solutions
"An Analysis Platform for Variability Reduction in “Big Data” Manufacturing Environments"    

Q. Peter He, Tuskegee University
"A New Virtual Metrology Approach for Semiconductor Manufacturing Processes"    

Jueun Kwak, Yonsei University
"Incremental Clustering-Based Semiconductor Fault Monitoring in Non-stationary Stream Data Situation"    

Jin Wang, Auburn University
"Non-threaded Run-to-Run Control"

Session 5

Session Chair: Dennis Föh

Chanhee Park, Korea University, Samsung Electronics
"Virtual Metrology Modeling of Time-Dependent Spectroscopic Signals Using a Fused Lasso Algorithm"    

Rupert Wagner, Texas Instruments Deutschland GmbH
"Development of a Plasma Etch Insitu Chamber Clean (ICC) and Analysis of etch plasma problems using a SEER plasma sensor"    

Haegyu Jang, Sungkyunkwan University
"Plasma Etching Endpoint Detection of Dielectric Layers with RF Impedance Monitoring and modified K-means Cluster Analysis"    

Michael Klick, Plasmetrex
"Process Stability in Photo Mask Manufacturing"   

13:30 - 13:40

Closing Remarks

Klaus Kabitzsch - Dresden University of Technology

13:40 - 15:00


Further conference days